Manufacturing method for printed circuit board, and printed circuit board

A technology of printed circuit boards and manufacturing methods, which is applied in the field of electronics and can solve problems such as complex process flow, inapplicability of high-layer boards, and high cost

Active Publication Date: 2018-10-02
SOUTH CHINA UNIV OF TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the blind / buried hole structure design is adopted. Although back drilling on the PCB board can be avoided, it is not suitable for high-layer boards, and the process is complicated and expensive.

Method used

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  • Manufacturing method for printed circuit board, and printed circuit board
  • Manufacturing method for printed circuit board, and printed circuit board
  • Manufacturing method for printed circuit board, and printed circuit board

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Embodiment Construction

[0025] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present invention, and do not limit the protection scope of the present invention.

[0026] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of illustration only and are not intended to represent the only embodiments.

[0027] Unless otherw...

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Abstract

The invention relates to a manufacturing method for a printed circuit board and the printed circuit board. The manufacturing method comprises the following steps: respectively drilling a first sub-board and a second sub-board; respectively drilling the first sub-board and the second sub-board; carrying out the electroplating of the holes drilled in the sub-board and the second sub-board to obtainelectroplated holes; performing the back drilling of short columns generated by electroplating of the holes in the first sub-board and the second sub-board, and obtaining back holes; and carrying outthe stitching of the first sub-board and the second sub-plate to form a mother board. The printed circuit board is fabricated using the method as described above. Through the above-mentioned manufacturing method, the hole depth of a back drilling hole of a PCB product with the thickness of 10 mm or less can be controlled to be 8 mil, which greatly improves the impedance continuity of the via holeand improves the transmission loss of the via hole. Moreover, the method has a simple process flow and is compatible with a conventional PCB process.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a method for manufacturing a printed circuit board and the printed circuit board. Background technique [0002] With the development of communication technology, the number of layers of PCB (Printed Circuit Board, printed circuit board) is getting higher and higher. At present, the number of layers of high-end communication products has reached 60 layers, which brings great challenges to PCB processing. At the same time, with the development of 5G and the Internet of Things, the backbone communication rate will increase to 400G, and the corresponding PCB single-channel rate will increase to 56G. [0003] With the continuous improvement of PCB data transmission rate, the influence of PCB process control on signal transmission is becoming more and more prominent. The main factors affecting PCB signal integrity In addition to design and PCB materials, vias also have a greater i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/46
CPCH05K3/0047H05K3/4623
Inventor 陈蓓姚若河王红飞
Owner SOUTH CHINA UNIV OF TECH
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