Method for optimizing differential via hole impedance, circuit board, equipment and storage medium

A differential via impedance, printed circuit board technology, applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of complex board manufacturing process, failure to meet design requirements, increase cost, etc., to improve link Impedance continuity, optimized via impedance, and the effect of reducing signal reflection
CN113597100APending Publication Date: 2021-11-02LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
Publication Date
2021-11-02

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Abstract

The invention provides a method for optimizing differential via hole impedance, a circuit board, equipment and a storage medium. The method comprises the following steps of: calculating the thickness of a via hole stub according to the wiring of a signal and the thickness of a printed circuit board; determining the back drilling depth of a signal hole according to the thickness of the via hole stub; and determining the back drilling depth of a ground hole according to the back drilling depth of the signal hole, and performing back drilling on the signal hole and the ground hole of the printed circuit board to be subjected to differential via hole impedance optimization, wherein the back drilling depth of the ground hole is not greater than the back drilling depth of the signal hole. The invention further provides a circuit board, equipment and a storage medium based on the method. The impedance property of the via hole needs to be concerned when the high-speed link is designed, and for the ultra-high-speed signal hole with back drilling, the reference ground hole can be subjected to back drilling design besides optimizing the size of the anti-bonding pad, so that the via hole impedance can be further optimized, the link impedance continuity can be improved, the signal reflection can be reduced, and the signal transmission quality can be effectively improved.
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Description

technical field

[0001] The invention belongs to the technical field of printed circuit board design, and in particular relates to a method for optimizing differential via impedance, a circuit board, equipment and a storage medium. Background technique

[0002] With the rapid development of microelectronics technology, the rising edge of the signal is getting faster and faster, and the transmission line effect produced by high-speed circuits is becoming more and more serious. For the current mainstream high-speed circuits, PCB engineers must adopt high-speed PCB design technology based on transmission line theory to ensure the normal operation of the circuit. The design and control of characteristic impedance is the core and foundation to solve the transmission line effect of high-speed circuits, and it has been paid more and more attention by PCB engineers and manufacturers. In order to obtain the final high-precision characteristic impedance circuit board products, it is n...

Claims

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