Immersed photoetching machine for semiconductor chip production
An immersion, semiconductor technology, applied in the field of lithography machines, can solve the problems of inconvenient operation, inability to adjust the position of the silicon wafer according to the needs of use, and fix it, and achieve the effect of preventing position deviation, convenient adjustment, and stable position
Active Publication Date: 2018-10-09
山东省阳信铭泰电气有限公司
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[0004] The purpose of the present invention is to provide an immersion photolithography machine for semiconductor chip production, to solve the problems of the above-mentioned background technology that most of them are fixed, the position of the silicon wafer cannot be adjusted according to the needs of use, and the operation is not convenient enough
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[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0017] see Figure 1-3 , the present invention provides a technical solution: an immersion photolithography machine for semiconductor chip production, including a body 1, a probe head 2, a cylinder 3, a cross bar 4, a connecting bar 5, a vertical bar 6, an adjustment block 7, and a fixing column 8. Short rod 9, iron block 10, fixing strip 11, vertical plate 12, groove 13, infrared emitter 14, glass window 15, loading plate 16, baffle plate 17, protective strip...
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The invention discloses an immersed photoetching machine for semiconductor chip production. The immersed photoetching machine comprises a main body, a cross rod, a vertical plate and a loading plate,wherein a probe is mounted at the upper end of the main body; one end of the cross rod is connected with the end position of an air cylinder; vertical rods are arranged at the two ends of a connectingrod; a fixed column penetrates through the interior of an adjusting block; an iron block is fixed on a short rod; the vertical plate is mounted at one end of the fixed column; an infrared emitter ismounted on the inner bottom surface of the main body; the loading plate is mounted at the tops of the vertical rods; a baffle is arranged on the side surface of the loading plate; a protection piece is arranged on the upper end surface of the loading plate. The immersed photoetching machine has the advantages that the central points of the immersed photoetching machine, the probe, the infrared emitter and a glass window are positioned in the same perpendicular line, the central lines are convenient to find during machining, the air cylinder can drive the loading plate to change the position through stretching, so that the position of a silicon wafer is convenient to adjust, and the baffle protects the silicon wafer by sliding on the side surface of the loading plate.
Description
technical field [0001] The invention relates to the technical field of photolithography machines, in particular to an immersion photolithography machine for semiconductor chip production. Background technique [0002] Lithography machine is also known as: mask alignment exposure machine, exposure system, lithography system, etc. The commonly used lithography machine is mask alignment lithography. The general lithography process has to go through the surface cleaning and drying of silicon wafers, primer coating, spin-coating photoresist, soft baking, alignment exposure, post-baking, development, and hard baking. , Etching and other processes, which means using light to make a graphic. [0003] The lithography machine needs to place the silicon wafer during work. However, most of the existing silicon wafer placement places are fixed, and the position of the silicon wafer cannot be adjusted according to the needs of use, and the operation is not convenient enough. In view of ...
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IPC IPC(8): G03F7/20
CPCG03F7/70775
Inventor 汪玉洁
Owner 山东省阳信铭泰电气有限公司