A thermoelectric separation heat dissipation structure for high-power LED

Abstract

The invention discloses a thermoelectric-separated radiating structure for a large-power LED. The thermoelectric-separated radiating structure comprises a radiating substrate, and an insulating layerand a copper foil layer orderly arranged on the radiating structure; a gap A and a gap B are successively formed in the insulating layer and the copper foil layer through the milling process; an LED package structure is arranged in the matched gap A and gap B, so that an LED base is connected with the radiating substrate; an PN junction arranged on the LED base is electrically connected with the copper foil layer through the electrode. By adopting the above technical scheme, the LED package structure can be directly clamped in the gap A and the gap B through the structure improvement; since the LED radiating base is directly connected with the radiating substrate, the heat produced by an LED chip can be directly conducted to the radiating substrate, the high-heat resistance insulating layer in the traditional radiating substrate is avoided, and the heat resistance of the large-power LED is greatly reduced.

Description

technical field [0001] The invention relates to the technical field of heat dissipation for high-power LEDs, in particular to a thermoelectric separation heat dissipation structure for high-power LEDs. Background technique [0002] With the rapid development of science and technology, people have higher and higher requirements for the luminous power of street lighting. As an excellent semiconductor optoelectronic device, LED has become an ideal solid-state energy-saving lighting source for a new generation due to its advantages of small size, low power consumption, long service life, and environmental protection. With the development of LEDs to high light intensity and high power, the problem of heat dissipation of LEDs has become increasingly prominent. The heat dissipation problem affects the light output characteristics of the LED and the life of the device, and is a key issue in high-power LED packaging. If the heat dissipation of the package is not good, the temperatu...

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Problems solved by technology

[0004] In the prior art, high-power LED lamp beads are directly packaged on the traditional aluminum-based copper-clad board (copper foil, insulating layer and aluminum plate from top to bottom), because the heat generated by the LED chip needs to pass through the insulating layer with high thermal resistance, resulting in Low heat dissipation efficiency Poor heat dissipation will increase the temperature of the chip, causing uneven stress distribution, shortening the life, and reducing the conversion efficiency of phosphor powder, resulting in a decrease in the light output efficiency of the chip

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