Manufacturing method of novel composite thermal column

Abstract

The invention provides a manufacturing method of a novel composite thermal column. By utilizing punching or squeezing, a pure copper metal barrel body and a bottom plate are manufactured, a pluralityof capillary structures such as sintered copper powder, copper nets and trenches are arranged in an inner cavity of the thermal column; and the capillary structures are sintered and assembled to ensure that capillary tissues in the cavity body fully communicate with each other, and the thermal column is manufactured in manners of welding, liquid injection and vacuum degassing. According to the manufacturing method of the novel composite thermal column disclosed by the invention, the problems of reflux blocking of working mediums in phase change processes of evaporation and condensation of liquid heat transfer working mediums are effectively solved, and the heat transfer performance is greatly improved; as a core element for carrying out heat dissipation, the use requirements of computer micro-processors, high-power LED illumination and integrated circuit heat radiators on high heat dissipation power and light weight can be met.

Description

technical field [0001] The invention relates to a core component of a heat dissipation device, in particular to a structure and a manufacturing method of a high-power LED light source heat transfer component used for heating electronic components. Background technique [0002] Most electronic products such as computers, communications, and photoelectric lighting will generate heat when they work. Solving the problem of heat dissipation plays a vital role in the normal operation and life of electronic products. Radiators made of heat columns as core heat transfer components have shown It is a heat dissipation component suitable for the development of new generation electronic products; it has achieved very good results in solving the heat dissipation of integrated single high-power LED lighting sources; in recent years, thermal column products have developed rapidly, but the structure is relatively single, very good There are many deficiencies in the solution to the complete ...

AI Technical Summary

Problems solved by technology

[0003] Aiming at the deficiencies of the prior art, the present invention provides a method for making a heat column. This structure makes the part of the main body of the heat transfer element part that needs to be brazed to each other be set between the bottom plate and the pipe body with a rectangular, triangular, or arc cross section. Various solder isolation measures such as shape and its combination, among which the capillary structure in the cavity is sintered copper powder can also effectively ensure that the silver alloy solder passes through the material isolation tank without being sucked into the capillary structure in the cavity, greatly improving the welding yield; The above measures effectively solve the problem of leakage caused by poor welding

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