Wafer gluing system used for lithography machine

A technology for wafers and lithography machines, which is applied in the fields of photoplate-making process coating equipment, electrical components, semiconductor/solid-state device manufacturing, etc. It can solve problems such as limitations and low suction cup levelness, and achieve increased rigidity and adjustment efficiency. and regulation accuracy, avoiding the effect of movement

Active Publication Date: 2018-10-12
博斯特机械制造新沂有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this technical solution can adjust the level of the suction cup, the technical solution can only adjust the level of the suction cup at a single angle, and the adjustment is realized by combining manual and naked eyes, resulting in the low level of the suction cup; restricted

Method used

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  • Wafer gluing system used for lithography machine
  • Wafer gluing system used for lithography machine
  • Wafer gluing system used for lithography machine

Examples

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Embodiment approach

[0026] As an embodiment of the present invention, the air supply unit 6 includes a rotating disk 61, a spherical stopper 62 and a spherical air supply block 63; the rotating disk 61 is fixedly connected to the rotating shaft of the motor, and the bottom surface of the rotating disk 61 is provided with There is an electromagnet 64, and the top surface of the rotating disk 61 is provided with three No. 1 slots, and the three No. 1 slots are evenly distributed in a circular array; the spherical stopper 62 is installed in the No. 1 slot by means of a movable rod 65. The outer layer of the movable rod 65 is covered with a spring, and the bottom end of the movable rod 65 is provided with a magnet, and the magnet is used to cooperate with the electromagnet 64; the installation method of the spherical air supply block 63 and the spherical stopper 62 is consistent; The number of the spherical stopper 62 is two, and the number of the spherical air supply block 63 is one. The motor drive...

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PUM

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Abstract

The invention relates the technical field of the semiconductor, and specifically is a wafer gluing system used for a lithography machine. The system comprises a sucking disk, a mounting base, a rotaryplate and a first motor; the rotary plate is installed in the mounting base; the first motor is used for driving the rotary plate to rotate; the system further comprises a liquid storage tank, a liquid level sensor, an adjusting module and a controller; the liquid level sensor is matched with the liquid storage tank to detect the inclination of the sucking disk; the adjusting module is used for adjusting the horizontal position of the sucking disk; the adjusting module is installed at the top of the rotary plate through a fixed rod; the liquid level sensor detects the liquid level of the liquid storage tank, so as to judge whether the sucking disk is located on a horizontal position or not; and when the sucking disk is inclined, the controller adjusts the sucking disk onto the horizontalposition through the adjusting module and the liquid level sensor. The wafer gluing system provided by the invention is mainly used for the lithography technique of the wafer, can automatically adjustthe levelness of the sucking disk, can prevent the sucking disk from shaking, and can improve the gluing efficiency of the wafer.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, in particular to a wafer gluing system for a photolithography machine. Background technique [0002] The photolithography process includes the steps of wafer leveling, that is, coating layer, pre-baking, exposure, development, film hardening, corrosion, and degumming. Among them, the leveling is to make the photoresist distributed on the wafer evenly distributed and able to Reach a certain thickness, so that the photoresist on the surface of the wafer can be properly photosensitive during exposure; when uniforming the glue, a motor is usually used to drive the wafer adsorbed on the vacuum chuck to rotate, so that the glue is evenly distributed under the action of centrifugal force On the wafer, the thickness of the adhesive film coating can be controlled according to the speed of the motor's rotating shaft. However, since the workbench may not be in a horizontal state during installation,...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/683G03F7/16
CPCG03F7/16H01L21/6715H01L21/67265H01L21/6838
Inventor 王青江振
Owner 博斯特机械制造新沂有限公司
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