Heat dissipation device with extended electronic components
A technology of electronic components and cooling devices, which is applied in the field of scalable electronic component cooling devices, can solve the problems of reducing the service life of electronic components, damage to electronic components, and different heights, and achieve the effect of increasing the service life
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[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention.
[0018] According to an embodiment of the present invention, a heat sink for electronic components with scalability is provided.
[0019] Such as figure 1 As shown, the heat sink device with expandable electronic components according to the embodiment of the present invention includes a housing 1, and the housing 1 includes a U-shaped connecting rod 3, a heat shield 7 and a heat shield 2 13, so One side of the housing 1 is provided with a motor 2, one side of the motor 2 and one end of the ho...
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