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Heat dissipation device with extended electronic components

A technology of electronic components and cooling devices, which is applied in the field of scalable electronic component cooling devices, can solve the problems of reducing the service life of electronic components, damage to electronic components, and different heights, and achieve the effect of increasing the service life

Inactive Publication Date: 2018-10-12
ANHUI MUFAN ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Electronic components are the basis of electronic products. Commonly used electronic components include: resistors, capacitors, inductors, potentiometers, transformers, transistors, diodes, ICs, etc. With the continuous improvement of electronic component manufacturing technology, the integration of electronic components is becoming more and more The higher the temperature, the too many electronic components will often bring overheating problems to the integrated circuit board. Since the heat dissipation has not been solved well, it will often cause damage to the electronic components, affect the usability of the electronic components, and also reduce the electronic components. The service life of the product will cause greater losses, and the electronic components are of different sizes and heights according to the design of the product. At present, there is no cooling device for electronic components of different sizes on the market, which has certain limitations.

Method used

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  • Heat dissipation device with extended electronic components

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Embodiment Construction

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention.

[0018] According to an embodiment of the present invention, a heat sink for electronic components with scalability is provided.

[0019] Such as figure 1 As shown, the heat sink device with expandable electronic components according to the embodiment of the present invention includes a housing 1, and the housing 1 includes a U-shaped connecting rod 3, a heat shield 7 and a heat shield 2 13, so One side of the housing 1 is provided with a motor 2, one side of the motor 2 and one end of the ho...

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Abstract

The invention discloses a heat dissipation device with extended electronic components. The device comprises a casing, one side of the casing is provided with a motor, one side of the motor is providedwith a U-shaped connecting rod, the middle of the U-shaped connecting rod is provided with a rotating shaft and a heat dissipation fan, one side of the U-shaped connecting rod is provided with a first heat insulating plate, the lower end of a first spring is provided with a first condensing pipe, the lower end of a first insulating sliding groove plate is provided with a first limiting block, oneside of the first heat insulating plate is provided with a first fixing block, the lower end of a lifting handle is connected with a screw rod, the lower end of the first fixing block is provided with a first sliding block and a second sliding block, the lower end of the first limiting block is provided with a plurality of second limiting blocks, the lower ends of the second limiting blocks are provided with second insulating sliding groove plates matched with the second limiting blocks, the lower ends of the second insulating sliding groove plates are provided with second condensing pipes, second heat dissipation sheets and second springs, and the lower ends of the second springs are provided with second heat insulating plates and second fixing blocks. The device has the advantages of achieving the effect of heat dissipation of the electronic components and prolonging the service life of motor components.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to an expandable heat sink for electronic components. Background technique [0002] Electronic components are the basis of electronic products. Commonly used electronic components include: resistors, capacitors, inductors, potentiometers, transformers, transistors, diodes, ICs, etc. With the continuous improvement of electronic component manufacturing technology, the integration of electronic components is becoming more and more The higher the temperature, the too many electronic components will often bring overheating problems to the circuit integrated board. Since the heat dissipation has not been solved well, it will often cause damage to the electronic components, affect the usability of the electronic components, and also reduce the electronic components. The service life of the product will cause greater losses, and the electronic components are of different sizes and he...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20318H05K7/20409
Inventor 储孝伦薛绘晴
Owner ANHUI MUFAN ELECTRONICS TECH CO LTD