A kind of release paper embossed board and its manufacturing method
A production method and technology of release paper, applied in the direction of special paper, papermaking, paper, etc., can solve the problems of difficult precise control of thickness and mass per unit area, so as to improve the smoothness and the ability of resisting the penetration of silicon-based coatings, and increase the resistance Heat and stability, convenient overall molding effect
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[0023] The invention provides a technical solution: a release paper embossed board and a manufacturing method thereof, comprising the following steps:
[0024] a. First select the raw material of the release paper;
[0025] b. After step a is completed, the raw materials are added to the heat-resistant agent;
[0026] c. After step b is completed, perform the PE coating of the release paper;
[0027] d. After step c is completed, perform silicon coating on the release paper;
[0028] e. After step d is completed, add the release coating layer;
[0029] f. After step e is completed, perform plate embossing treatment on the release paper;
[0030] g. After step f is completed, cooperate with the slitting machine to slitting;
[0031] h. After step g is completed, finally carry out packaging treatment.
[0032] In the described step a, the quantitative aspect of the base paper generally selects paper above 125g / m2, and selects the softwood pulp and the hardwood pulp proporti...
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