Reflow soldering equipment

Abstract

The invention discloses reflow soldering equipment which is provided with a reflow soldering hearth. The hearth is internally provided with at least two load bearing devices, a first rail and a secondrail are loaded at the positions, close to the two ends, of each load bearing device, the surfaces of the first rail and the second rail are provided with a first transmission chain and a second transmission chain which are used for supporting reflow soldering PCBs, and the first transmission chain and the second transmission chain are driven by driving components connected with the first transmission chain and the second transmission chain to move around the corresponding rails to achieve transportation of the reflow soldering PCBs; and each load bearing device is further provided with a third rail, the surface of each third rail is provided with a third transmission chain which is equal to the first transmission chains and the second transmission chains in height and supports the middleportions of the reflow soldering PCBs, and the third transmission chains are driven by driving components connected with the third transmission chain to move around the third rails. By means of the reflow soldering equipment, input of a reflow oven carrier can be avoided, the manufacturing cost is saved, meanwhile, manpower is saved, and the board bending risk of the PCBs is reduced.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, in particular to a reflow soldering equipment. Background technique [0002] Now the PCB production process adopted by the electronics industry needs to go through the reflow soldering process. In the reflow soldering process, due to the soldering temperature (this depends on the auxiliary material for soldering, that is, solder paste) may exceed the T of the PCB g The temperature (glass transition temperature point) will cause the substrate of the PCB board to soften and collapse. In order to prevent the deformation of the PCB caused by this, in the reflow process, the PCB board with a width greater than 200mm is generally used to support the PCB board, so as to prevent the deformation of the PCB board. To prevent the deformation of the PCB board, otherwise, once the deformation is serious, it will affect the yield and reliability of SMT and other subsequent production processes....

AI Technical Summary

Problems solved by technology

In the reflow soldering process, due to the soldering temperature (this depends on the auxiliary material for soldering, that is, solder paste) may exceed the T of the PCB g Temperature (glass transition temperature point) causes the substrate of the PCB board to soften and collapse. In order to prevent the deformation of the PCB caused by this, in the reflow process, the PCB board with a width greater than 200mm is generally supported by a carrier, so as to prevent To prevent the deformation of the PCB board, otherwise, once the deformation is serious, it will affect the yield and reliability of SMT and other subsequent production processes. When producing large-sized boards, such as boards above 300mm*300mm, it is necessary to make PCB The reflow soldering fixture on the first side of the board is as figure 1 as shown, figure 1 It is a schematic diagram of the reflow soldering fixture used in the prior art. It can be seen that this increases the cost of the fixture, and also requires manpower to continuously carry out board removal and placement operations, which is more complicated and increases labor costs, which is not in line with the current industry Streamlined Manufacturing Trend

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