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Siphon type cooling system and cooling method of whole cabinet server

A heat dissipation system and siphon technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of reducing heat dissipation efficiency, the radiator cannot meet the demand, and the heat transfer area is too large, so as to improve the heat dissipation efficiency. Effect

Pending Publication Date: 2018-10-19
BEIJING BAIDU NETCOM SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the layout of the motherboard components of the server node and the space size of the server system are designed according to specific requirements, so the size of the radiator is limited, and the heat transfer area cannot be increased. However, the power consumption density of the CPU or GPU is increasing. The heat transfer area required for heat dissipation is also increasing, and traditional radiators cannot meet the demand due to size limitations, thereby reducing heat dissipation efficiency

Method used

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  • Siphon type cooling system and cooling method of whole cabinet server
  • Siphon type cooling system and cooling method of whole cabinet server
  • Siphon type cooling system and cooling method of whole cabinet server

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Embodiment Construction

[0044] Aiming at the problems existing in the prior art, the present invention proposes a siphon heat dissipation system, which adopts the principle of siphon and phase-change heat to dissipate heat for the whole cabinet server, thereby improving heat dissipation efficiency and the like.

[0045] In order to make the technical solution of the present invention more clear and understandable, the solution of the present invention will be further described below with reference to the accompanying drawings and examples.

[0046] Apparently, the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0047] figure 2 It is a schematic diagram of the composition and structure of the embodiment of the siphon heat dissipation system of the present invention. Such ...

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Abstract

The invention discloses a siphon type cooling system and a cooling method of a whole cabinet server. The method comprises the steps of mounting an evaporator on a predetermined heating source in a server node of the whole cabinet server; and mounting a condenser between the server node of the whole cabinet server and a fan wall, so that a working medium liquid in the evaporator is vaporized afterabsorbing heat of a heating source, and a working medium gas after vaporization enters the condenser, is condensed into the working medium liquid and enters the evaporator again. By applying the scheme, the cooling efficiency and the like can be improved.

Description

【Technical field】 [0001] The invention relates to heat dissipation technology, in particular to a siphon heat dissipation system and a heat dissipation method for a whole cabinet server. 【Background technique】 [0002] The whole rack server is the core form of the ultra-large-scale data center infrastructure. It subverts the design structure and product form of the traditional rack server. It adopts a modular design and integrates power supply, heat dissipation and management in one rack, which can save power consumption and improve performance. space utilization etc. [0003] In the existing whole rack server, for the central processing unit (CPU, Central Processing Unit) or graphics processing unit (GPU, Graphics Processing Unit) and other heat sources in the server node, in order to realize heat dissipation, usually directly on the CPU or GPU Install a radiator, the heat of the CPU or GPU is conducted to the radiator, and then taken away by the cooling air, such as figu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 谭显光陈国峰张家军
Owner BEIJING BAIDU NETCOM SCI & TECH CO LTD