A microelectronic cooling device
A technology of heat dissipation device and microelectronics, applied in the field of microelectronics, can solve the problems of poor heat dissipation effect, easy to burn equipment, reduce the operation efficiency of microelectronic equipment such as chips, etc., and achieve the effect of improving heat dissipation effect.
Active Publication Date: 2020-06-26
郎溪万鹏科技中介服务有限公司
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Problems solved by technology
The theoretical basis of its development is modern physics established from the end of the 19th century to the 1930s. Microelectronics technology includes a series of specialized technologies such as system circuit design, device physics, process technology, material preparation, automatic testing, packaging, and assembly. , Microelectronics technology is the sum of various process technologies in microelectronics. Due to the small size and high power operation of microelectronic equipment, it generates very high heat, and excessive heat will easily reduce the operating efficiency of microelectronic equipment such as chips. At the same time, it is easy to burn the equipment, so it is very important for the heat dissipation of microelectronic equipment. At this stage, most of them use heat sinks to dissipate heat, but the heat dissipation effect is poor
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[0017] Through the description of the embodiments below, the specific implementation of the present invention includes the shape, structure, mutual position and connection relationship between the various parts, the function and working principle of each part, the manufacturing process and the operation and use method of the various components involved. etc., to make further detailed descriptions to help those skilled in the art have a more complete, accurate and in-depth understanding of the inventive concepts and technical solutions of the present invention.
[0018] Such as Figure 1 to Figure 4 As shown, a microelectronic cooling device includes a base 1, the base 1 is provided with an inner cavity, and a liquid with a boiling point of 45-60 degrees Celsius is stored in the inner cavity, and the top of the base 1 is also provided with fins A cooling device and an air cooling device, the fin cooling device is used to increase the heat dissipation area of the gas, and the ...
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The invention discloses a microelectronic heat dissipation device, and relates to the technical field of microelectronics. The device includes a base. The base is provided with a cavity. A liquid witha boiling point of 45-60 DEG C is stored in the cavity. The top of the base is provided with a fin cooling device and a wind cooling device. The fin cooling device is used for increasing the heat dissipation area of gas. The wind cooling device is used for accelerating the heat dissipation speed of the whole device. The heat dissipation function of the device is realized by evaporation related heat absorption and condensation related heat dissipation of the liquid, and the heat dissipation effect of the heat dissipation device is improved through the design of the fin cooling device and the wind cooling device.
Description
technical field [0001] The invention relates to the technical field of microelectronics, in particular to a microelectronic cooling device. Background technique [0002] Microelectronics technology is a new technology developed along with integrated circuits, especially VLSIs. The theoretical basis of its development is modern physics established from the end of the 19th century to the 1930s. Microelectronics technology includes a series of specialized technologies such as system circuit design, device physics, process technology, material preparation, automatic testing, packaging, and assembly. , Microelectronics technology is the sum of various process technologies in microelectronics. Due to the small size and high power operation of microelectronic equipment, it generates very high heat, and excessive heat will easily reduce the operating efficiency of microelectronic equipment such as chips. , At the same time, it is easy to burn the equipment, which is very important ...
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IPC IPC(8): H01L23/367H01L23/467H01L23/473
CPCH01L23/367H01L23/467H01L23/473
Inventor 夏森黄耀陈大龙芮望颐
Owner 郎溪万鹏科技中介服务有限公司