Semi-hole circuit board manufacturing method
A circuit board manufacturing, circuit board technology, applied in the directions of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve the problems of large space occupation, difficult quality assurance, manufacturing difficulty and high cost, and achieve the improvement of drilling quality and improvement. The quality of the circuit board, the effect of eliminating internal stress
Active Publication Date: 2018-10-23
四川普瑞森电子有限公司
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Problems solved by technology
At present, the commonly used connection methods take up a lot of space, and some connection methods that take up a small space are difficult and costly to manufacture, and the quality is not easy to guarantee
Method used
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Embodiment Construction
[0036] combine Figure 1 to Figure 5 ,
[0037] Manufacturing method of the present invention comprises the following steps:
[0038] S1, open the material, and bake the raw material plate, the baking temperature is 150°C, and the baking time is more than 4 hours;
[0039] S2, removing the oxygen layer from the raw material plate processed in step S1 by micro-etching, and processing the wiring on the surface of the inner layer;
[0040] S3, press the raw material board processed in step S2 on the surface with insulating layer and copper foil, hot pressing time 2.5 hours, hot pressing temperature 140-205 degrees, hot pressing pressure 100-380PSI, hot pressing and then cold pressing, cold pressing The pressing time is more than 2 hours; after pressing, a four-layer circuit board can be formed.
[0041] S4, drilling the raw material plate processed in step S3, and baking after drilling, the baking temperature is 150°C, and the baking time is greater than 4 hours;
[0042] S5,...
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The invention discloses a semi-hole circuit board manufacturing method, and the method comprises the following steps: S1, cutting a material, and baking a raw material board, wherein the baking temperature is 150 DEG C and the baking time is greater than 4 hours; S2, removing an oxygen layer of the raw material board processed at step S2 through a micro-etching method, and processing the wiring ofan internal surface; S3, carrying out the stitching of an insulating layer and copper foil on the surface of the raw material board processed at step S2, wherein the hot pressing time is 2.5hours, the hot pressing temperature is 140-250 degrees, the hot pressing pressure is 100-380 PSI; carrying out the cold pressing after hot pressing, wherein the cold pressing time is greater than 2 hours; S4,carrying out the drilling of the raw material board at step S3, and carrying out the baking after drilling, wherein the baking temperature is 150 DEG C, and the baking time is greater than 4 hours; S5, removing the oxygen layer on the raw material board processed at step S4 through the micro-etching method, and then carrying out the technology of electroless plating copper; S6, carrying out the wiring processing of the external surface of the raw material board processed at step S5; S7, carrying out the electro-coppering of the raw material board processed at step S6. The method provided by the invention is low in manufacturing cost, and is high in circuit board quality.
Description
technical field [0001] The invention belongs to the field of circuit board addition, in particular to a method for manufacturing a half-hole circuit board. Background technique [0002] The circuit board is an installation carrier of electronic components in electronic products. The electronic components are installed on the circuit board, and then connected to form a circuit through the wiring on the circuit board to complete the circuit function. With the development of integrated circuits, the functions of integrated circuits become more and more powerful, more and more pins are required by integrated circuits, and more and more wirings are required on circuit boards. In order to arrange more traces in the circuit board, the circuit board has developed from a single-sided board to a double-sided board, and a multi-layer board. In current electronic equipment, in addition to requiring powerful functions, the miniaturization of electronic equipment is also required, that i...
Claims
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IPC IPC(8): H05K3/00H05K3/28H05K3/42
CPCH05K3/0047H05K3/282H05K3/42H05K2201/09581H05K2203/0214H05K2203/0242
Inventor 刘庆辉
Owner 四川普瑞森电子有限公司