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Coil pattern, method for forming same, and chip device with coil pattern

A coil pattern and pattern technology, which is applied in coil manufacturing, transformer/inductor coil/winding/connection, transformer/inductor parts, etc., can solve the problems of increased resistance and reduced inductance of coil pattern, so as to reduce resistance, The effect of increasing the inductance

Active Publication Date: 2020-09-22
MODA INNOCHIPS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Therefore, when the coil pattern is formed to the same height as that of an ideal shape in consideration of the inductance of the coil pattern, the inductance of the coil pattern is the same, but the resistance of the coil pattern varies depending on the upper edge portion. gain by loss
In addition, when the coil pattern is formed to have the same cross-sectional area as a cross-sectional area of ​​an ideal shape in consideration of the resistance of the coil pattern, the inductance of the coil pattern may decrease due to an increase in the height of the coil pattern.

Method used

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  • Coil pattern, method for forming same, and chip device with coil pattern
  • Coil pattern, method for forming same, and chip device with coil pattern
  • Coil pattern, method for forming same, and chip device with coil pattern

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Embodiment Construction

[0040] Hereinafter, exemplary embodiments of the present invention will be explained in detail with reference to the accompanying drawings. However, this invention may be embodied in different forms and should not be construed as limited to only the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0041] figure 1 is a plan view of the coil pattern according to the first exemplary embodiment, and figure 2 is along figure 1 Sectional view taken along line A-A' shown. in addition, image 3 is a partial cross-sectional view of the coil pattern, and Figure 4 is a plan view of a coil pattern according to the second exemplary embodiment.

[0042] refer to Figure 1 to Figure 4 , the coil pattern 200 according to an exemplary embodiment may be formed on at least one surface of the substrate 100 . That is, the coil pattern...

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Abstract

The present invention provides a coil pattern, a method for forming the same, and a chip device having the coil pattern, the coil pattern being formed on at least one surface of a substrate and comprising: a first plating film formed on the substrate; and The second plated film is formed to cover the first plated film. Since the coil pattern of the present invention has the second plating film formed so as to cover the first plating film, compared with the conventional technique of forming the coil pattern by a single process, the inductance can be increased to the same extent and reduced as the conventional technique. resistance.

Description

technical field [0001] The invention relates to a coil pattern and a forming method thereof, in particular to a coil pattern capable of increasing inductance and reducing resistance, a forming method thereof, and a chip device having the coil pattern. Background technique [0002] As a type of chip device, a power inductor is mainly disposed in a power supply circuit, such as a DC-DC converter in a portable device. With higher frequency applications and miniaturization of power supply circuits, such power inductors have been increasingly used to replace wound choke coils. In addition, with the miniaturization and multi-functionalization of portable devices, power inductors have been developed in terms of miniaturization, high current, and low resistance. [0003] In general, power inductors are each configured to include a body formed of a ferrite material, a substrate disposed in the body, a coil pattern formed on the substrate, and a coil pattern formed outside the body t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F41/04H01F17/00H01F27/28H01F27/32
CPCH01F17/0013H01F27/292H01F2017/048H01L23/645H01F27/2804H01F27/29H01F27/323H01F41/041H01F2027/2809
Inventor 朴寅吉赵承勳金炅泰郑俊镐朴相俊
Owner MODA INNOCHIPS CO LTD
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