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A method of manufacturing a microphone module, a printed circuit board pcb, and a terminal

A technology of printed circuit boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, multi-layer circuit manufacturing, and printed circuit assembly of electric components, which can solve the problem of small space for sound guide channels, and achieve the solution of too small space and enlarged space , Avoid the effect of sound becoming smaller and distorted

Active Publication Date: 2021-02-12
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a microphone module, a method for manufacturing a printed circuit board PCB, and a terminal, so as to solve the problem that the space of the sound guide channel in the structure of the MIC sound output in the prior art is too small

Method used

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  • A method of manufacturing a microphone module, a printed circuit board pcb, and a terminal
  • A method of manufacturing a microphone module, a printed circuit board pcb, and a terminal
  • A method of manufacturing a microphone module, a printed circuit board pcb, and a terminal

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Embodiment Construction

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0032] The present invention aims at the problem that the space of the sound guide channel is too small in the structure of the MIC sound output in the prior art, and provides a microphone module, such as figure 1 shown, including:

[0033] A printed circuit board PCB1, and a microphone 2 and a sound guide structure 3 respectively connected to the PCB1;

[0034] Wherein, the surface connected to the PCB1 on the microphone 2 is provided with a sound gu...

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Abstract

The invention provides a microphone module, a method for manufacturing a printed circuit board PCB, and a terminal, wherein the microphone module includes: a printed circuit board PCB, and a microphone and a sound guide structure respectively connected to the PCB; The surface connected to the PCB is provided with a sound guide hole, and the sound guide hole is surrounded by the PCB and the sound guide structure to form a cavity, and the cavity constitutes the sound guide channel of the microphone module; the PCB is used to form a sound guide Grooves are provided on the surface of the channel. This solution can expand the space of the sound guide channel by setting grooves on the surface of the PCB used to form the sound guide channel, and can avoid the sound caused by the too small space of the sound guide channel caused by the sound cavity foam being squeezed. Smaller and distorted; well solved the problem that the space of the sound guide channel in the structure of the MIC sound output in the prior art is too small.

Description

technical field [0001] The invention relates to the technical field of terminals, in particular to a microphone module, a method for manufacturing a printed circuit board (PCB), and a terminal. Background technique [0002] For mobile terminal products, lighter and thinner is the current development direction of products. For the convenience of carrying, modern portable consumer electronic products are getting smaller and smaller, which can better reflect the ultimate product and improve user experience. The internal design layout is also becoming more and more compact, and the space utilization of the internal circuit board (hereinafter referred to as PCB) directly affects the thickness of the mobile communication product. PCB device layout is one of the key influencing factors for making ultra-thin mobile communication products. During PCB layout, the placement of some peripheral modules is restricted, such as the layout of a microphone (hereinafter referred to as MIC). ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R1/08H04R1/34H05K1/18H05K3/30H05K3/46
CPCH04R1/083H04R1/342H04R2499/11H05K1/18H05K3/30H05K3/4611
Inventor 徐职华
Owner VIVO MOBILE COMM CO LTD
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