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MEMS chip and electric packaging method

A chip and electrode technology, applied in the field of MEMS chips and their electrical packaging

Active Publication Date: 2018-11-02
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The application provides a MEMS chip and its electrical packaging method to solve the problem of how to realize the electrical packaging of MEMS-SOI chips

Method used

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  • MEMS chip and electric packaging method
  • MEMS chip and electric packaging method
  • MEMS chip and electric packaging method

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Embodiment Construction

[0034] The optical switch matrix based on MEMS-SOI chips has extremely low loss, so MEMS-SOI chips have great advantages in the application of optical switching systems. MEMS-SOI chips are composed of optical switch matrix and optical input (I) / output (O) Regional composition. The following briefly introduces the application scenarios of the optical switch matrix.

[0035] One of the basic functions of communication networks is to send signals from different sources to designated destinations, figure 1 It is a schematic diagram of OXC routing function, such as figure 1 As shown, the signal of user 1 is input through port 1 and needs to be output through port 14 to the destination; the signal of user 2 is input through port 7 and needs to be output through port 11 to the destination. The unit implementing the routing function is called an optical cross connect (OXC), and the core device of the OXC is an optical switch matrix.

[0036] figure 2 It is a schematic diagram of an...

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Abstract

The invention provides an MEMS chip and an electric packaging method. The MEMS chip comprises an MEMS device layer, a first isolated layer located below the MEMS device and a first conductive layer located below the first isolated layer; the first isolated layer is provided with first conductive through holes as many as conductive structure positions in a first region and electrode positions in asecond area; the first conductive lay is provided with mutually independent M electrodes; M electrodes are respectively connected with the M first conductive through holes; the M is set based on the number of the conductive structures and the number of electrodes in the second area; and the electrodes at the first conductive layer, which correspond to the conductive structure positions in the first area are electrically connected with the electrodes at the first conductive layer, which correspond to the electrode positions in the second area in one-to-one correspondence. Consequently, electricpackaging of the MEMS-SOI chip is realized.

Description

technical field [0001] The present application relates to the technical field of semiconductor element packaging, and in particular to a micro-electro-mechanical system (Micro-Electro-Mechanical System, MEMS) chip and an electrical packaging method thereof. Background technique [0002] In our life, there are many chips with various functions. Chips are a general term for semiconductor component products. Chips need to be electrically packaged before they can be used. Electrical packaging refers to connecting the electrodes in the chip to the PCB. The electrical connection between the chip and the drive circuit, so that the chip can be controlled from the outside. [0003] The characteristic of the MEMS chip is that it has a movable structure on the surface of the chip, so other materials cannot be covered on the surface of the chip to avoid damage to the movable structure. MEMS chips include micromirror MEMS chips and MEMS-SOI (silicon on insulator (Siliconon Insulator, SO...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/02B81C1/00
CPCB81B7/02B81C1/00261B81C2203/01B81C1/00B81B7/0006B81B7/04B81B2201/045B81B2207/053B81B2207/07B81B2207/092B81C1/00095B81C2203/0109B81B7/007B81B2207/096B81B2207/097B81C1/00301B81B7/0064B81B2201/042
Inventor 魏玉明
Owner HUAWEI TECH CO LTD