Degumming liquid preparation system for silicon wafer adopting diamond wire cutting
A diamond wire cutting and silicon wafer degumming technology is applied in the field of silicon wafer degumming liquid configuration system, which can solve the problems of reduced production efficiency, prolonged production time, incomplete degumming of silicon wafers, etc., so as to reduce energy consumption and improve production efficiency. Effect
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[0048] In order to explain the overall concept of the present invention more clearly, the following will be described in detail by way of examples in conjunction with the accompanying drawings.
[0049] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited by the specific details disclosed below. EXAMPLE LIMITATIONS.
[0050] In addition, in the description of the present invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal" ", "Top", "Bottom", "Inner", "Outer", "Axial", "Radial", "Circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings , is only for the co...
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