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Flexible membrane radiator

A heat sink and flexible membrane technology, applied in the thermal field, can solve problems such as limited installation direction, bending and accumulation of flexible membranes, and achieve the effects of simple manufacturing process, fast heat transfer speed, and high heat dissipation efficiency

Pending Publication Date: 2018-11-06
WEIHAI YUNSHAN TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when a thinner flexible diaphragm is used, not only the installation direction is limited during use, but also the flexible diaphragm often bends and accumulates, reducing the effective heat dissipation area and not suitable for manufacturing high-power radiators, which seriously affects ventilation and heat dissipation. effect; and when thicker and firmer fins are used, the effective heat dissipation area is greatly reduced

Method used

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  • Flexible membrane radiator

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Embodiment 1: attached figure 1 , figure 2 The shown flexible diaphragm radiator is composed of a heat conducting diaphragm group 10, a skeleton 20, and an isolation grid 30. The heat conducting diaphragm group 10 is placed in the skeleton 20, and the isolation grid 30 is fixed on the skeleton 20; the heat conducting diaphragm group 10 is composed of several square small-area flexible heat-conducting membranes 11 and several pieces of "convex"-shaped large-area flexible heat-conducting membranes 12 arranged alternately and stacked, and the small-area flexible heat-conducting membranes 11 and large-area flexible heat-conducting membranes 12 After the combination, one thickness side a is aligned and ground, and the ground thickness side is pasted on the surface of the integrated circuit 40 with heat-conducting adhesive, outside the overlapping surface of the small-area flexible heat-conducting film 11 and the large-area flexible heat-conducting film 12 An air gap layer ...

Embodiment 2

[0031] Example 2: image 3 Shown is a flexible membrane heat exchanger in which strip-shaped large-area flexible heat-conducting membranes 12 and strip-shaped small-area flexible heat-conducting membranes 11 are stacked alternately. The length direction is arranged at 90°. 40 in the figure is the heat source to be dissipated.

Embodiment 3

[0032] Example 3: Figure 4 Shown is a flexible membrane heat exchanger in which strip-shaped large-area flexible heat-conducting membranes 12 and strip-shaped small-area flexible heat-conducting membranes 11 are stacked alternately. The seed diaphragms are arranged at 90° along the length direction. 40 in the figure is the heat source to be dissipated.

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PUM

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Abstract

The invention relates to the field of heat transfer and heat radiation, in particular to a flexible membrane radiator. The flexible membrane radiator comprises a heat-conducting membrane group, a framework, and an isolation grid, wherein the heat-conducting membrane group is arranged in the framework; the isolation grid is fixed on the framework; the heat-conducting membrane group comprises two ormore small-area flexible heat-conducting membranes and two or more large-area flexible heat-conducting membranes which are alternately arranged and superposed; clamp plates and bolts are arranged onthe framework; the clamp plates are arranged on the two side surfaces in the height direction of the large heat-conducting membrane group; and the isolation grid comprises isolators mounted among theprotruded large-area membranes and slats for fixing the isolators. The flexible membrane radiator provided by the invention has the advantages that the flexible membrane radiator can be mounted in anydirection, bending or stacking of the flexible heat-conducting membranes is avoided, and a large heat capacity, a high heat transfer speed, high heat radiation efficiency, a simple manufacture process and low production cost are achieved. The flexible membrane radiator can be widely applied in heat radiation systems for power electronics, microelectronics, and optoelectronics.

Description

technical field [0001] The invention belongs to the thermal field, in particular to heat transfer and heat dissipation technology and devices of heat sources. Background technique [0002] Radiators are used in various thermal power conversion, electro-optical conversion, electrothermal conversion and other systems, and it plays a very important role in the reliability of system operation. Especially in the circuit system, the temperature is very sensitive, and the heat dissipation problem has become one of the bottlenecks of electronic devices. [0003] The current radiators used in power electronics, microelectronics, and optoelectronic systems mainly include metal fins and coatings, heat pipes, micropipes, graphite fins, and graphite diaphragms. The metal fin and coating type have small relative heat capacity, low thermal conductivity, high weight and large volume for places requiring high thermal conductivity. The heat pipe radiator only has one-dimensional heat conduc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367
CPCH01L23/367H01L23/3672
Inventor 王政玉王华涛
Owner WEIHAI YUNSHAN TECH