Assembly method of semiconductor refrigeration equipment

Abstract

The invention discloses an assembly method for semiconductor refrigeration equipment. The assembly method comprises the steps that 1, a cold end heat conduction base is placed into an installing cavity, and meanwhile, a heat pipe and the cold end heat conduction base are assembled and connected; 2, a thermal insulation support is arranged on an inner container, and the heat pipe is arranged on theinner container; 3, a box covers the exterior of the inner container, the thermal insulation support is arranged in a pre-assembling hole, and a foaming cavity is formed between the box and the innercontainer; 4, a foaming material is injected into the foaming cavity for foaming, and the foaming material is fixed to form a foaming layer; and 5, a semiconductor refrigeration chip is placed into an installing hole, then a heat end heat conduction base is installed on the surface of the part, exposed out of the pre-assembling hole, of the thermal insulation support. The cooling capacity lossesof a semiconductor refrigeration module can be achieved, the refrigeration efficiency of the refrigeration equipment is improved, and energy consumption is reduced.

Description

technical field [0001] The invention relates to refrigeration equipment, in particular to an assembly method of semiconductor refrigeration equipment. Background technique [0002] At present, with the development of semiconductor refrigeration technology, refrigeration equipment using semiconductor refrigeration chips for refrigeration is widely used. Chinese Patent No. 2014107111772 discloses a semiconductor refrigeration equipment that uses the cooling capacity generated by semiconductor refrigeration chips to achieve refrigeration. The semiconductor refrigeration chip includes a cold end that releases cold energy and a hot end that releases heat. During operation, the cold end of the semiconductor refrigeration chip releases cold energy into the refrigeration compartment of the refrigeration device through the cold end radiator, and the semiconductor refrigeration The hot side of the chip needs to dissipate heat to the outside through the hot side heat sink. However, in...

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Problems solved by technology

However, in the actual assembly process, since the housing of the refrigeration equipment needs to be foamed, the position of the heat conductor in the cold end radiator is likely to change due to the influence of the expansion of the foam material, so that the heat conductor cannot be well positioned. Contact with the semiconductor refrigeration chip, resulting in serious loss of cooling capacity

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