A kind of semiconductor diode production process
A production process and diode technology, applied in the direction of semiconductor devices, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as object damage and diode damage
Active Publication Date: 2021-04-27
济南固锝电子器件有限公司
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Problems solved by technology
[0004] The pickling process of this technical solution is to fully contact the diode with the acid solution during the pickling process through ultrasonic waves; during ultrasonic cleaning, thousands of atmospheric pressures will be generated due to cavitation, which can destroy insoluble dirt, but at the same time Damage to objects, causing diode damage
Method used
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Embodiment approach
[0040] As an embodiment of the present invention, a groove is provided on the top of the first slider 32; a group of rotating rods 321 are arranged on the side of the groove; the middle part of the rotating rod 321 is rotatably mounted on the side of the groove. A torsion spring is arranged in the rotating shaft of the rotating rod 321 . During work, the first slider 32 moves and squeezes to the guide post 35. By setting a set of rotating rods 321, the impact of the first slider 32 on the guide post 35 is reduced on the one hand, and the guide post 35 squeezes and rotates on the other hand. The rod 321 swings, and the rotating rod 321 stirs the pickling liquid to increase the flow of the pickling liquid.
[0041] As an embodiment of the present invention, a group of agitation modules 4 are provided on the outer ring of the support plate 33; The mounting plate 41 is fixedly connected to the outer ring of the support plate 33; the second slider 42 is installed in the chute of t...
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The invention belongs to the technical field of semiconductor diode production, and specifically relates to a semiconductor diode production process. The process uses a pickling machine. The pickling machine includes a box body, a pickling box and a swing module; a swing module is arranged inside the box body. The swing module includes a turntable, a first slider, a support plate, a telescopic rod and a guide column; the pickling box is installed on the support plate of the swing module, the pickling box is used to place semiconductor diodes, and the swing module is used to improve the pickling solution. Mobility, improve pickling efficiency of semiconductor diodes. In the present invention, by controlling the speed of the motor to be different, the distance that the first slider slides outward under the action of centrifugal force is different, and correspondingly squeezed to the guide pillars of different lengths, so that the inclination of the support plate is different. By periodically controlling the motor The speed of the rotating speed, the support plate rotates and swings at the same time, increases the flow of pickling liquid, and improves the efficiency of semiconductor diode pickling.
Description
technical field [0001] The invention belongs to the technical field of semiconductor diode production, in particular to a semiconductor diode production process. Background technique [0002] A semiconductor diode refers to a two-terminal electronic device that utilizes the characteristics of a semiconductor. The most common semiconductor diodes are PN junction diodes and metal semiconductor contact diodes. Their common feature is the asymmetry of the volt-ampere characteristics, that is, the current exhibits good conductivity in one direction, but high resistance in the opposite direction. It can be used as rectification, wave detection, voltage stabilization, constant current, variable capacity, switch, light emitting and photoelectric conversion, etc. Tunnel diodes for ultra-high frequency amplification or ultra-high-speed switching can be made by using the tunnel effect of carriers in highly doped PN junctions. With the rapid development of society, the application of...
Claims
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IPC IPC(8): H01L21/329H01L21/67
CPCH01L21/67017H01L29/6609
Inventor 陈涛
Owner 济南固锝电子器件有限公司