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Simple testing method of bonding firmness of coating layer and substrate of heat-sensitive paper

A technology combining firmness and testing methods, applied in measuring devices, analytical materials, instruments, etc., can solve the problems of judging the firmness of the bond between the coating layer of thermal paper and the substrate, no corresponding comparison data, and long testing time period, etc. Achieve the effects of convenient retrieval and inspection, intuitive effect and low instrument cost

Inactive Publication Date: 2018-11-16
JIANGSU WANBAO RUIDA HI TECH CO LTD
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AI Technical Summary

Problems solved by technology

This test method only reflects the firmness of the thermal paper coating layer in the printing process, but the main use of thermal paper is thermal printing, whether the thermal paper coating layer is peeled off by the thermal head adhesive of the thermal printer, and whether the thermal The coating layer of sensitive paper is tested by IGT instrument. There is no corresponding comparison data, and the speed of picking cannot be directly used to judge the degree of bonding between the coating layer of thermal paper and the substrate.
On the other hand, when checking the firmness of the thermal paper coating layer during the production process, it is necessary to control whether the coating firmness of the products converted from various processes meets the printing requirements. The IGT instrument is used to test the napping speed. The test period is long, which is not conducive to rapid printing. Instruct production to improve process measures to control the firmness of the coating layer

Method used

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  • Simple testing method of bonding firmness of coating layer and substrate of heat-sensitive paper
  • Simple testing method of bonding firmness of coating layer and substrate of heat-sensitive paper

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Embodiment Construction

[0020] The present invention is described in further detail now in conjunction with accompanying drawing. These drawings are all simplified schematic diagrams, which only illustrate the basic structure of the present invention in a schematic manner, so they only show the configurations related to the present invention.

[0021] Such as figure 2 As shown, a simple test method for the bonding firmness of the coating layer of thermal paper and the substrate, including the following steps:

[0022] (1) Keep the surface of the thermal paper clean, cut out a thermal paper with a size of 297mm×297mm and marked with vertical and horizontal characters, lay it flat on the soft cloth layer of the backing board and keep the coating layer of the thermal paper upward;

[0023] (2) Put the adhesive surface of the tape 3 close to the upper surface of the thermal paper and naturally flatten it on the upper surface of the thermal paper along the transverse direction of the thermal paper, use ...

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Abstract

The invention relates to a simple testing method of bonding firmness of a coating layer and a substrate of heat-sensitive paper. The bonding firmness of the coating layer and the substrate of the heat-sensitive paper can be quickly detected, production control or improvement of product quality is facilitated, steps are simple, the operation is simple, and the instrument cost is low.

Description

technical field [0001] The invention relates to a test method, in particular to a simple and simple test method for the bonding firmness of a coating layer of thermal paper and a base material. Background technique [0002] The degree of bonding between the coating layer of thermal paper and the substrate is usually tested by an IGT instrument, and the speed of the napping is used to indirectly reflect the degree of bonding between the coating layer and the substrate. This test method only reflects the firmness of the thermal paper coating layer in the printing process, but the main use of thermal paper is thermal printing, whether the thermal paper coating layer is peeled off by the thermal head adhesive of the thermal printer, and whether the thermal The coating layer of sensitive paper is tested by IGT instrument. There is no corresponding comparison data, and the speed of napping cannot be directly used to judge the degree of bonding between the coating layer of thermal ...

Claims

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Application Information

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IPC IPC(8): G01N19/04
CPCG01N19/04
Inventor 王道力贾爱琪亓华利
Owner JIANGSU WANBAO RUIDA HI TECH CO LTD
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