A method of manufacturing a pcb

Abstract

The invention relates to the technical field of circuit board production, and discloses a manufacturing method of a PCB, comprising the following steps: S1, providing a first substrate having a firstthrough groove, a second substrate, a third substrate having a second through groove and a fourth substrate, and forming a circuit pattern on the surface of the fourth substrate; S2, sequentially laminating the first substrate, the second substrate, the third substrate and the fourth substrate, and forming a multilayer board by compression; S3, subjecting the multilayer board to copper immersion and electroplating to metallize the groove wall and the groove bottom of a first groove; S4, milling the groove bottom of the first groove at the top of the second through groove to form a second groove; and S5, forming a third through groove in the groove bottom of the second groove. The manufacturing method of the PCB according to the present invention realizes the mounting of the special-shapedcomponent and a plurality of components of different sizes, reduces the occupied space of the PCB, and forms a circuit pattern at the groove bottom of the stepped groove, which is beneficial to further miniaturization of the PCB.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for manufacturing a PCB. Background technique [0002] Printed circuit board (PCB for short) is the provider of electrical connection for electronic components. Before the appearance of printed circuit boards, the interconnection between electronic components relied on the direct connection of wires to form a complete circuit. In contemporary times, circuit panels only exist as effective experimental tools, and printed circuit boards have occupied an absolute dominant position in the electronics industry. [0003] In order to meet the high-density mounting or crimping requirements of printed circuit boards, multi-layer printed circuit boards are designed to open stepped grooves to reduce the assembly volume. The current stepped groove design mostly shows first-order metallization or non-metallization Step slots are used in microwave radio frequency pro...

AI Technical Summary

Problems solved by technology

[0004] 1) The shape of the first-order stepped groove is single, and it is impossible to mount components with special-shaped structures;

[0005] 2) A single metallized or non-metallized stepped groove cannot meet the special assembly requirements of components at the same time, or integrate other more power amplifier devices

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