Wafer cutting equipment

Abstract

The invention relates to the technical field of semiconductor manufacturing accessory devices, in particular to wafer cutting equipment which can enhance the powder cleaning effect; a user can use thewafer cutting equipment conveniently; the operation speed is improved; the wafer cutting equipment comprises a cutting table, a clamping mechanism, an exhaust fan and an operation mechanism, whereina first exhaust pipe is arranged above the cutting table; the wafer cutting equipment further comprises a tapered collecting shield, a gravity dust removing box, a flow stopping plate, a gathering groove, a second exhaust pipe, a transition pipe, a third exhaust pipe, an upper fixing ring, a lower fixing ring, one set of upper supporting rods, one set of lower supporting rods, a filter cloth bag,a withdrawing rod, a first connection rod and a second connection rod; and the wafer cutting equipment further comprises an upper base, a lower base, one set of upper sliding blocks, one set of lowersliding blocks, one set of upper rolling beads, one set of lower rolling beads, an upper threaded rod, a lower threaded rod, one set of handles, a limiting rod, a rotary rod, a left threaded rod and alengthening rod.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing auxiliary devices, in particular to a wafer cutting device. Background technique [0002] As we all know, wafer cutting equipment is an auxiliary equipment for cutting wafers of different sizes, which has been widely used in the field of semiconductor manufacturing; existing wafer cutting equipment includes cutting tables, clamping mechanisms, The exhaust fan and the operating mechanism, the clamping mechanism and the operating mechanism are all installed on the top side wall of the cutting table, a first exhaust pipe is arranged above the cutting table, and an exhaust fan is arranged at the output end of the first exhaust pipe; the existing wafer When the cutting equipment is in use, the user places the input end of the first exhaust pipe above the cutting table, uses the clamping mechanism to clamp the wafer to be cut, and then controls the cutting equipment to cut through th...

AI Technical Summary

Problems solved by technology

[0002] As we all know, wafer cutting equipment is an auxiliary equipment for cutting wafers of different sizes, which has been widely used in the field of semiconductor manufacturing; existing wafer cutting equipment includes cutting tables, clamping mechanisms, The exhaust fan and the operating mechanism, the clamping mechanism and the operating mechanism are all installed on the top side wall of the cutting table, a first exhaust pipe is arranged above the cutting table, and an exhaust fan is arranged at the output end of the first exhaust pipe; the existing wafer When the cutting equipment is in use, the user places the input end of the first exhaust pipe above the cutting table, uses the clamping mechanism to clamp the wafer to be cut, and then controls the cutting equipment to cut through the operating mechanism, and the user connects the exhaust fan to the outside world. Power connection, under the action of suction of the exhaust fan, the powder generated during cutting is drawn out along the first exhaust pipe; in the use of existing wafer cutting equipment, it is found that the cleaning effect of the powder generated during cutting is poor, and the recycling rate is low. Low; the clamping mechanism cannot rotate with the user's movement, and the use limitations are high; the operating mechanism is difficult to rotate, the operating speed is slow, and the work efficiency is low

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