The invention relates to the technical field of
semiconductor manufacturing accessory devices, in particular to
wafer cutting equipment which can enhance the
powder cleaning effect; a user can use thewafer
cutting equipment conveniently; the operation speed is improved; the
wafer cutting equipment comprises a cutting table, a clamping mechanism, an exhaust fan and an operation mechanism, whereina first
exhaust pipe is arranged above the cutting table; the
wafer cutting equipment further comprises a tapered collecting shield, a gravity dust removing box, a flow stopping plate, a gathering groove, a second
exhaust pipe, a transition
pipe, a third
exhaust pipe, an upper fixing ring, a lower fixing ring, one set of upper supporting rods, one set of lower supporting rods, a filter cloth bag,a withdrawing rod, a first connection rod and a second connection rod; and the wafer cutting equipment further comprises an upper base, a lower base, one set of upper sliding blocks, one set of lowersliding blocks, one set of upper rolling beads, one set of lower rolling beads, an upper
threaded rod, a lower
threaded rod, one set of handles, a limiting rod, a rotary rod, a left
threaded rod and alengthening rod.