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A method for enhancing the connection strength between ceramic sheet and surface electrode layer in piezoelectric ceramic sheet

A piezoelectric ceramic sheet and surface electrode technology, applied in the field of piezoelectric ceramics, can solve the problem of weak connection with the metal layer, and achieve the effects of improving the interface connection strength, tensile strength, and contact area.

Active Publication Date: 2020-04-17
SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] In order to overcome the above-mentioned problem that the connection between the ceramic and the metal layer is not firm, the present invention provides a method for enhancing the connection strength between the ceramic sheet and the surface electrode layer in the piezoelectric ceramic sheet. The electrode layer is removed while the grooves are distributed parallel to each other, and then the surface electrode layer is plated on the surface of the piezoelectric ceramic sheet where the groove is formed, so as to enhance the connection strength between the surface electrode layer and the ceramic sheet in the piezoelectric ceramic sheet. The depth of the groove is greater than the thickness of the surface electrode layer

Method used

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  • A method for enhancing the connection strength between ceramic sheet and surface electrode layer in piezoelectric ceramic sheet
  • A method for enhancing the connection strength between ceramic sheet and surface electrode layer in piezoelectric ceramic sheet
  • A method for enhancing the connection strength between ceramic sheet and surface electrode layer in piezoelectric ceramic sheet

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Effect test

Embodiment 1

[0044] The upper and lower surfaces of a piezoelectric ceramic sheet with a thickness of 1.5 mm are cleaned after being grooved, and the copper electrode layer (surface electrode layer) is plated. The groove depth is 0.1 mm, the groove width is 0.5 mm, and the groove spacing is about 0.5 mm. Wherein, the preparation method of the copper electrode layer is sputtering and evaporation, and the thickness of the copper electrode layer is 0.8 μm. Sputtering is a type of physical vapor deposition. It introduces a magnetic field on the surface of the target cathode (copper, silver, etc.), and uses the magnetic field to confine the charged particles to increase the plasma density to increase the sputtering rate. The electrode metal layer (copper, silver, etc.) is prepared on a single crystal, etc., to obtain a piezoelectric ceramic sheet with grooves distributed on the surface. Then, the piezoelectric ceramic sheets without grooves (with copper electrodes on the upper and lower surfaces...

Embodiment 2

[0054] The upper and lower surfaces of the piezoelectric ceramic sheet with a thickness of 1.5mm are cut and cleaned, and the silver electrode layer (surface electrode layer) is plated. The groove depth is 0.15mm, the groove width is 0.4mm, and the groove spacing is about 0.4mm. Wherein, the preparation method of the silver electrode layer is sputtering evaporation, the thickness of the silver electrode layer is about 0.8 μm, and the piezoelectric ceramic sheet with grooves distributed on the surface is obtained. The piezoceramic sheet without grooves (with silver electrodes on the upper and lower surfaces and a thickness of 0.8μm) and 6 piezoelectric ceramic sheets with grooves on the surface were compared for the tensile test of the silver electrode metal layer (see Table 3).

[0055] Put the above uncut groove ( image 3 ), grooved ( Figure 4 ) Two kinds of piezoelectric ceramic sheets were screen-printed with phenolic resin adhesive, and 10 sheets each were bonded together in...

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Abstract

The invention relates to a method for enhancing the connection strength between the ceramic sheet and the surface electrode layer in the piezoelectric ceramic sheet, comprising: removing the electrode layer while forming grooves distributed parallel to each other on at least one of the upper and lower surfaces of the piezoelectric ceramic sheet, and then removing the electrode layer at the same time A surface electrode layer is plated on the surface of the piezoelectric ceramic sheet where the groove is formed, so as to enhance the connection strength between the surface electrode layer and the ceramic sheet in the piezoelectric ceramic sheet, and the depth of the groove is greater than the thickness of the surface electrode layer.

Description

Technical field [0001] The invention relates to a method for enhancing the connection strength between a ceramic sheet and a surface electrode layer in a piezoelectric ceramic sheet, in particular to the connection between a piezoelectric ceramic and an electrode metal layer, in particular to a piezoelectric ceramic sheet-electrode layer metal layer bonding surface, ceramics The firmness and reliability of the sheet-binder-ceramic sheet bonding surface belong to the field of piezoelectric ceramics. Background technique [0002] Using the piezoelectric effect of piezoelectric ceramics, devices for various purposes can be designed and manufactured. Such as ceramic speakers, microphones, and pickups used in electro-acoustic devices; underwater acoustic transducers and fish detectors used in underwater communication and detection; ceramic surfaces used in radars, televisions and computers Wave devices and ceramic transformers; piezoelectric accelerometers and piezoelectric gyroscope...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L41/29H01L41/293H01L41/297H01L41/047H10N30/06H10N30/063H10N30/067H10N30/87
CPCH10N30/874H10N30/871H10N30/87H10N30/063H10N30/067H10N30/06
Inventor 时雪阮学政李国荣刘文斌曾江涛郑嘹赢满振勇
Owner SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI