Universal polyhedral sputtering film coating device and design method thereof

Abstract

The invention relates to the technical field of thin film preparation, in particular to a universal polyhedral sputtering film coating device and a design method thereof. The device is characterized in that the outer side surface of a substrate loading plate is polyhedral, each substrate loading plate comprises a plurality of bearing surfaces which are vertically arranged, and the size of each bearing surface meets the requirements for bearing a substrate. The device has the advantages that the film thickness consistency of coated film can be ensured, and the quality of the coated film is improved; under the condition that the size of a cylindrical rotating workpiece frame is fixed, more substrates can be borne, the yield is increased, and the efficacy is improved; the device is simple andreasonable in structure, high in adaptability, capable of being correspondingly designed according to the substrates with different sizes, convenient to disassemble and replace and suitable for popularization.

Description

technical field [0001] The invention relates to the technical field of thin film preparation, in particular to a general polyhedron sputter coating device and a design method thereof. Background technique [0002] Improving coating efficiency and coating quality, and expanding the scope of application of coating are the goals pursued in the field of vacuum coating technology. In recent years, the market for electronic products such as smart phones and tablet computers has been booming; correspondingly, the quality improvement of these smart terminals has also put forward higher requirements for the coating technology of touch screens required by such products. Among them, how to be compatible with substrates of different sizes without affecting their lateral uniformity is one of the key points in the development of coating technology. [0003] At present, the application of automatic magnetron sputtering coating machine has become increasingly widespread. For substrate coa...

AI Technical Summary

Problems solved by technology

The key point of this technology is that the workpiece holder is a circular rotating mechanism. On the basis of keeping the target base distance constant at a specific circumference diameter, the circumference is equally divided into different planes. Different planes can make substrates of different sizes obtain the highest production capacity. , for a planar substrate, during the rotation of the above-mentioned workpiece holder, the rotation radius of each point on the substrate is different, which will lead to unequal distances from the sputtering target to different positions on the planar substrate, resulting in inconsistent film thickness

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