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Image sensor, camera module and electronic equipment

An image sensor and image technology, applied in image communication, television, electrical components, etc., can solve the problems of final result deviation, inability to meet the position production between modules, calibration accuracy requirements, etc.

Pending Publication Date: 2018-11-27
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the module-level assembly method, it may not be able to meet the position production and calibration accuracy requirements between modules
Such as binocular distance measurement, image fusion and other scenarios, a small distance or angle deviation will cause a large deviation to the final result

Method used

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  • Image sensor, camera module and electronic equipment
  • Image sensor, camera module and electronic equipment
  • Image sensor, camera module and electronic equipment

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Embodiment Construction

[0020] The application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only some structures related to the present application are shown in the drawings but not all structures.

[0021] It should be noted that due to the continuous improvement of semiconductor technology and process level, image sensor (ImageSensor) as a basic device for visual information acquisition, because it can realize information acquisition, conversion and expansion of visual functions, provides intuitive, multi- Hierarchical and rich visual image information has more and more applications. The most widely used solid-state image sensors in the related art mainly include charge-coupled device (CCD) image sensors and...

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PUM

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Abstract

The embodiment of the invention discloses an image sensor, a camera module and electronic equipment. The image sensor comprises at least two image sensing areas arranged on a substrate, and peripheralcircuits around the image sensing areas, wherein each image sensing area is provided with multiple pixels arranged in an array way; each peripheral circuit is provided with a column reading circuit and an analog-digital converter; the pixels of the at least two image sensing areas share the analog-digital converter. By adopting the technical scheme provided by the embodiment of the invention, thesame wafer is used as the substrate, the image sensor of a multi-shooting system is designed and formed on the substrate, and the analog-digital converter is reused through the multiple image sensingareas, so that the assembling accuracy of the multi-shooting system can be improved, and the area of the peripheral circuits on the substrate can be reduced, and the sizes of the image sensor and thecamera module can be further reduced.

Description

technical field [0001] Embodiments of the present application relate to semiconductor device technology, and in particular to an image sensor, camera module and electronic equipment. Background technique [0002] An electronic device with multiple camera modules can separately control different cameras to perform different functions, so that the pictures captured by the cameras have more content and are clearer, and the images are more refined and the colors are more vivid. [0003] However, a multi-camera system with multiple camera modules in the related art is usually obtained by assembling the multiple camera modules through brackets. like figure 1 As shown, the first camera module 10 and the second camera module 20 are assembled into a multi-camera system through a bracket 130 . Each camera module includes an image sensor (140, 150) and a lens assembly (110, 120), wherein the lens assembly (110, 120) includes a lens, a mirror seat and a motor. The image sensor (140, ...

Claims

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Application Information

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IPC IPC(8): H04N5/369H04N5/225
CPCH04N23/54H04N25/70
Inventor 武隽
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD