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Film removing method for Parylene film

A technology of parylene and film layer, which is applied in the field of film removal of parylene film, can solve the problem that the precision of film removal cannot meet the requirements, and achieve the effect of good removal quality and high efficiency

Active Publication Date: 2018-11-30
夏禹纳米科技(深圳)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The accuracy of masking and film removal in the traditional parylene coating process can no longer meet the requirements, and a new subversive technology is needed to solve this problem

Method used

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  • Film removing method for Parylene film
  • Film removing method for Parylene film
  • Film removing method for Parylene film

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Embodiment Construction

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0021] A method for removing a parylene coating, comprising the steps of:

[0022] S1. Import the circuit board drawing of the parylene film to be removed into the computer system, and select the film removal area of ​​the circuit board through the computer control software;

[0023] S2. Through the optical inspection system (AOI) to scan the circuit board to remove the parylene film and compare the image obtained by scanning with the circuit board drawing imported...

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Abstract

The invention provides a film removing method for a Parylene film. The method is specifically a method for removing a Parylene film on a circuit board by using high-energy ultra-short pulse laser. Within a certain distance from a circuit board from which a film is to be removed, the Parylene film on the circuit board is irradiated by ultra-short pulse laser, absorbs the high-energy ultra-short pulsed laser and acts. Atoms of a Parylene film material are "electrified" and undergo "Coulomb explosion". A chemical bond between methyl (-CH2-) in the Parylene film is broken by energy emitted by thelaser, so that the film can be removed without causing heat accumulation. The method has high removal quality and high efficiency, and can be used for precisely removing unwanted Parylene films without damaging electronic components on the circuit board.

Description

technical field [0001] The invention relates to the technical field of circuit board parylene coating layer treatment, in particular to a method for removing the parylene film layer. Background technique [0002] Parylene English name: Parylene. A new type of conformal coating material developed and applied by Union Carbide Co. in the United States in the mid-1960s. It is a polymer of p-xylene. According to different molecular structures, Parylene can be divided into N-type, C-type, and D-type. , F type, HT type and other types. Parylene thin films are generally prepared by a unique low-pressure chemical vacuum vapor deposition process (LPCVD technology). The film-forming process is to "grow" a fully conformal polymer film coating on the surface of the substrate by the small molecules of the active parylene monomer, which can be applied to surfaces of various shapes, including sharp edges, known as " "Penetrate" penetrates deep into cracks and internal surfaces. The 0.1-...

Claims

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Application Information

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IPC IPC(8): H05K3/22B08B7/00
CPCH05K3/22B08B7/0042
Inventor 刘万满
Owner 夏禹纳米科技(深圳)有限公司