The invention provides a
parylene coating and film removing method for a
semiconductor cooler, and relates to the technical field of
coating removing, the method comprises the following steps: forming a
mask layer at a specific position of the
semiconductor cooler, then
coating parylene film
layers inside and outside the
semiconductor cooler, rotating the semiconductor cooler through a rotating device, and removing the
parylene film
layers from the
mask layer. And when the included angles between the
base line of the rotating mechanism and the
laser are 0 degree, alpha degree, 90 degree, 90 + alpha degree, 180 degrees and 270 degrees,
laser cutting is carried out, and when the included angles are alpha degrees and 90 + alpha degrees, the shielded area on the semiconductor cooler is
cut. According to the method, the angle rotating mode is adopted, so that the mutually-shielded surfaces between the semiconductor cooler
welding columns can be exposed, and the
laser can
cut the mutually-shielded areas. Meanwhile, a continuous rotating mode is adopted,
laser cutting can be connected end to end on different side faces, no dead angle is left when the film layer is broken, and the wiredrawing phenomenon of the film layer is avoided after the
mask layer and the parylene layer are removed.