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68 results about "Parylene coating" patented technology

Parylene has become the protective coating of choice for challenging electronics, aerospace and medical applications. Conformal coatings are generally liquid in nature, while Parylene is formed on surfaces from a high purity powder known as a dimer with no liquid stage.

Method and apparatus for applying external coating to grid array packages for increased reliability and performance

A method and apparatus are disclosed for selective removal of a conformal coating from the solder balls of grid array packages such that the benefits of the coating are realized. An ancillary benefit of the invention is improved process-ability of the grid array package by improving the mechanical containment of the solder during the reflow process and improved electrical isolation between the individual solder attachment points. For example, a method for coating a ball grid array is provided, which includes coating the ball grid array with a thin layer of parylene. Next, the solder ball side of the part is butter smeared or squeegeed with a water soluble coating and assembled wet. A mask having holes in the same pattern as the balls in the grid, and a thickness that is about 80% of the height of the balls, is applied to the solder ball side of the part. This side of the part is then butter smeared again with the water soluble coating, and the entire assembly is allowed to dry. At this point, about 20% of each parylene-coated solder ball protrudes higher than the surface of the mask. The solder ball side of the part is then grit blasted with an abrasive material. The extent that the abrasive material removes the parylene coating from the solder balls is limited by the mask and the layer of water soluble coating. Therefore, the grit blasting removes the parylene coating from only the protruding areas (e.g., about top 20%) of the solder balls. Water is then used to remove the water soluble coating, and the parylene coated part is baked to remove moisture. Thus, a parylene coated ball grid array (or column grid array) is provided that is highly impervious to moisture, has a very high dielectric strength, and thereby improves the electrical performance and reliability of the surface mounted part.
Owner:HONEYWELL INT INC

Preparation method for high-insulation hard nanometer protection coating of composite structure

The invention provides a preparation method for a high-insulation hard nanometer protection coating of a composite structure, belonging to the field of plasma technology. According to the method, a reaction cavity is vacuumized and inert gas is introduced to allow a substrate to move, so organosilicon monomers with low dipole moment and high chemical inertia are screened out; the free volume and compactness of a coating are regulated and controlled through multifunctionality monomers, so the coating is allowed to have insulating properties and excellent protection performance and wear resistance at the same time; and an organosilicon coating is deposited on the coating with high insulating properties, and surface hard treatment is carried out so as to form a hard coating with a compact structure. The high-insulation hard nanometer protection coating provided by the invention has more excellent protection performance, insulating properties and wear resistance compared with conventionalcoatings such as parylene under the condition of same thickness. The preparation method provided by the invention overcomes the problems of poor wear resistance, too great thickness, low production efficiency and the like of conventional parylene coatings; and through hard treatment, a composite wear-resistant silica structure is increased in the coating, and the hardness and wear resistance of the coating are effectively improved.
Owner:JIANGSU FAVORED NANOTECHNOLOGY CO LTD

Preparation method for super-hydrophobic aluminum surface

The invention provides a preparation method for the super-hydrophobic aluminum surface. The preparation method comprises the following steps that (1) an aluminum sheet is pretreated, specifically, the aluminum sheet is sequentially placed into a detergent aqueous solution, an ethanol solution and a deionized aqueous solution for ultrasonic wave cleaning, and the aluminum sheet is subjected to electrolytic polishing treatment; (2) anodizing is conducted, specifically, the aluminum sheet is put into a phosphoric acid solution for anodizing and then put into a phosphoric acid solution for pore broadening; and (3) chemical vapor deposition (CVD) evaporation is conducted, specifically, the aluminum sheet is put into parylene coating equipment after being anodized, and even parylene evaporation is achieved by controlling the reaction conditions. According to the novel preparation method for the super-hydrophobic aluminum surface, the anodizing method and the CVD evaporation method are combined. A prepared aluminum surface thin film is good in hydrophobic property, high in stability and good in cold resistance and humidity resistance; the control over the thickness of the coating can be achieved by controlling the input amount of the parylene, and the thin film with the nano-scale thickness is obtained.
Owner:STATE GRID HEBEI ENERGY TECH SERVICE CO LTD

Machining technology and machining device facilitating parylene coating detection

PendingCN109338334ASolve problems that are not easy to detectDetection is clear and intuitiveFluorescence/phosphorescenceChemical vapor deposition coatingDecompositionWhitening Agents
The invention discloses a machining technology and a machining device facilitating parylene coating detection, and belongs to the technical field of chemical vapor deposition. The machining technologycomprises the steps that fluorescent whitening agent powder is arranged in a sublimation cup, a vacuum deposition chamber is sealed, a vacuum system is used for conducting pumping to achieve vacuum,a cooling controller is utilized for controlling the temperature of the area of the vacuum deposition chamber, a parylene material is placed in an evaporation chamber to be heated and gasified, and gas is formed after the splitting decomposition reaction is conducted in a splitting decomposition chamber; and a sublimation cup heating switch is turned on, the heating temperature is set, the constant temperature is kept, the fluorescent whitening agent powder is deeply evaporated in the sublimation cup, a discharging valve is closed, a heating power source is turned off, the vacuum deposition chamber is opened, a machined workpiece is taken out and placed on a detection table, and an ultraviolet lamp is used for conducting irradiation detection. According to the machining technology and themachining device facilitating parylene coating detection, the fluorescent whitening agent powder is sublimated and evenly deposited on the machined workpiece, the coating protectiveness is not damaged, the ultraviolet lamp is used for irradiation for detection, and visual observation can be achieved for the machined product effect.
Owner:JIANGSU KERUN PHOTOELECTRIC TECH CO LTD

Method and apparatus for applying external coating to grid array packages for increased reliability and performance

A method and apparatus are disclosed for selective removal of a conformal coating from the solder balls of grid array packages such that the benefits of the coating are realized. An ancillary benefit of the invention is improved process-ability of the grid array package by improving the mechanical containment of the solder during the reflow process and improved electrical isolation between the individual solder attachment points. For example, a method for coating a ball grid array is provided, which includes coating the ball grid array with a thin layer of parylene. Next, the solder ball side of the part is butter smeared or squeegeed with a water soluble coating and assembled wet. A mask having holes in the same pattern as the balls in the grid, and a thickness that is about 80% of the height of the balls, is applied to the solder ball side of the part. This side of the part is then butter smeared again with the water soluble coating, and the entire assembly is allowed to dry. At this point, about 20% of each parylene-coated solder ball protrudes higher than the surface of the mask. The solder ball side of the part is then grit blasted with an abrasive material. The extent that the abrasive material removes the parylene coating from the solder balls is limited by the mask and the layer of water soluble coating. Therefore, the grit blasting removes the parylene coating from only the protruding areas (e.g., about top 20%) of the solder balls. Water is then used to remove the water soluble coating, and the parylene coated part is baked to remove moisture. Thus, a parylene coated ball grid array (or column grid array) is provided that is highly impervious to moisture, has a very high dielectric strength, and thereby improves the electrical performance and reliability of the surface mounted part.
Owner:HONEYWELL INT INC

Manufacturing method for patterned sensitive metal or metal oxide material

The invention relates to a manufacturing method for patterned sensitive metal or a metal oxide material. The manufacturing method comprises the following steps of enabling a layer of sensitive metal or metal oxide material to be grown on a substrate in a vacuum environment; enabling a layer of dielectric layer to be grown on the sensitive metal or metal oxide material; enabling a parylene coating layer to be grown on the dielectric layer; transferring a pattern on photoresist to the parylene coating layer by means of photoetching and etching methods; removing the photoresist by an acetone solution to realize patterning of the parylene coating layer; by taking the parylene coating layer as masking, etching the dielectric layer and the sensitive metal or the metal oxide material by a dry etching method at the same time to realize pattern transferring; and removing the parylene coating layer by a mechanical stretching method to realize the patterning of the sensitive metal or the metal oxide material. By adoption of the manufacturing method, contact between the sensitive metal and the metal oxide material and air can be avoided as for as possible, so that influence to the performance of the semiconductor device can be avoided.
Owner:INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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