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Method for preparing super-hydrophobic copper surface by combining electro-deposition with CVD

An electrodeposition and combination technology, applied in the field of preparation of superhydrophobic surfaces, can solve the problems of restricting the practical application of metal surfaces, time-consuming, cumbersome and other problems, and achieve the effect of excellent superhydrophobic performance.

Inactive Publication Date: 2016-04-13
STATE GRID HEBEI ENERGY TECH SERVICE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] There are many methods for preparing superhydrophobic copper surfaces, such as surface chemical treatment, surface physical treatment, surface coating technology, plasma surface treatment technology, etc. These measures are cumbersome, time-consuming, and even pollute the environment, which greatly restricts the metal surface. practical application of

Method used

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  • Method for preparing super-hydrophobic copper surface by combining electro-deposition with CVD

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] (1) Copper sheet pretreatment

[0029] Put the copper sheet into anhydrous acetone, absolute ethanol and deionized aqueous solution in turn, and perform ultrasonic cleaning, each cleaning time is 10~20min; The slices were mechanically polished.

[0030] (2) Electrodeposition reaction

[0031] Connect the copper sheet treated in step (1) with the anodized aluminum template using a clamp, such as figure 1 As shown, the upper splint 1 is arranged on the upper part of the lower splint 2, the porous glass 4, the anodized aluminum template 5 and the copper sheet 6 are arranged from top to bottom and placed between the upper splint 1 and the lower splint 2, and the upper splint 2 is fixed by bolts 3. Press between the splint 1 and the lower splint 2, the copper sheet 6 is provided with a wire 7, the copper sheet is used as the cathode, and the platinum electrode is used as the anode to contain 350g / LNiSO 4 , 50g / LNiCl 2 ·6H 2 O and 450g / LH 3 BO 3 The nickel ion solution...

Embodiment 2

[0038] (1) Copper sheet pretreatment

[0039] Put the copper sheet into acetone solution, ethanol solution and deionized water solution in turn, and perform ultrasonic cleaning, each cleaning time is 10~20min; Mechanically polished.

[0040] (2) Electrodeposition reaction

[0041] Connect the copper sheet treated in step (1) with a commercial anodized aluminum template using a fixture, such as figure 1 As shown, the upper splint 1 is arranged on the upper part of the lower splint 2, the porous glass 4, the commercial anodized aluminum template 5 and the copper sheet 6 are arranged from top to bottom and placed between the upper splint 1 and the lower splint 2, and the Press between the upper splint 1 and the lower splint 2, the copper sheet 6 is provided with a wire 7, the copper sheet is used as the cathode, and the platinum electrode is used as the anode to contain 300g / LNiSO 4 , 100g / LNiCl 2 ·6H 2 O and 400g / LH 3 BO 3 The nickel ion solution was used as the electroly...

Embodiment 3

[0048] (1) Copper sheet pretreatment

[0049] Put the copper sheet into acetone solution, ethanol solution and deionized water solution in turn, and perform ultrasonic cleaning, each cleaning time is 10~20min; Mechanically polished.

[0050] (2) Electrodeposition reaction

[0051] Connect the copper sheet treated in step (1) with a commercial anodized aluminum template using a fixture, such as figure 1 As shown, the upper splint 1 is arranged on the upper part of the lower splint 2, the porous glass 4, the commercial anodized aluminum template 5 and the copper sheet 6 are arranged from top to bottom and placed between the upper splint 1 and the lower splint 2, and the Press between the upper splint 1 and the lower splint 2, the copper sheet 6 is provided with a wire 7, the copper sheet is used as the cathode, and the platinum electrode is used as the anode to contain 320g / LNiSO4 , 75g / LNiCl 2 ·6H 2 O and 500g / LH 3 BO 3 The nickel ion solution was used as the electrolyte,...

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Abstract

The invention discloses a method for preparing a super-hydrophobic copper surface by combining electro-deposition with CVD. The method comprises the following steps: (1) copper sheet pre-treatment: sequentially placing a copper sheet into acetone solution, ethanol solution and deionized water solution, ultrasonically cleaning, and then mechanically polishing; (2) combining the copper sheet with a commercial anodic alumina template through a fixture, taking the copper sheet as a cathode, taking a platinum electrode as an anode, and taking nickel ion solution as an electrolyte for carrying out electro-deposition reaction; and (3) using small Parylene coating equipment for carrying out CVD chemical evaporation, so as to prepare the super-hydrophobic copper surface; and through a test, the obtained super-hydrophobic copper surface is excellent in super-hydrophobic performance, and capable of being used in the aspects of anti-fouling, anti-rusting and self-cleaning applications for a metallic copper surface. The method disclosed by the invention is simple to operate, short in processing time, and high in controllability.

Description

technical field [0001] The invention relates to a method for preparing a superhydrophobic surface, in particular to a method for preparing a superhydrophobic copper surface by combining electrodeposition and CVD. Background technique [0002] A surface with a contact angle greater than 150° and a sliding angle less than 10° is called a superhydrophobic surface. A typical example is the lotus leaf that "gets out of the mud without staining". Superhydrophobic surface has many excellent surface properties, such as self-cleaning, anti-corrosion, anti-icing and other properties, so it has broad application prospects in industrial production and people's daily life, such as self-cleaning clothes, anti-corrosion coatings, power transmission Line anti-icing and so on. [0003] Copper and its alloys have broad application prospects in industrial production due to their high storage capacity, high electrical conductivity, and high thermal conductivity. Failure due to chemical corros...

Claims

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Application Information

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IPC IPC(8): C25D5/02C25D3/12C23C14/12C23C14/24
CPCC25D5/022C23C14/12C23C14/24C25D3/12
Inventor 徐雪霞陈志强王庆冯砚厅侯双林
Owner STATE GRID HEBEI ENERGY TECH SERVICE CO LTD
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