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Method for processing workpiece

A technology of processed objects and processing methods, applied in the direction of semiconductor devices, other household appliances, electrical components, etc., can solve problems such as difficult fixing, and achieve the effect of efficient peeling and damage prevention

Active Publication Date: 2018-12-04
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the workpiece is firmly fixed when the front protection tape is peeled off, the chips will not touch each other. However, when the front protection tape is peeled off, the workpiece is held by a flexible sheet that can be expanded, so it is difficult to firmly fix the workpiece. Fixed
And, when the chip size becomes smaller, this problem occurs more remarkably

Method used

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  • Method for processing workpiece
  • Method for processing workpiece
  • Method for processing workpiece

Examples

Experimental program
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Effect test

Embodiment Construction

[0040] 1 expansion unit

[0041] figure 1The shown expanding device 1 is an example of a expanding device capable of expanding the expanding sheet 8 attached to the workpiece. The expansion device 1 has a three-layer structure, having: a device base 100a extending along the first direction at the first layer; a device base 100b extending along the first direction at the second layer; and extending along the first direction at the third layer. A pair of guide bases 103. An opening 101 for communication with the side of the device base 100a is formed in a central portion of the device base 100b. Guide rails 104 extending along the first direction are respectively laid on the pair of guide bases 103 . On the rear side of the device base 100a, 100b in the first direction, an annular frame providing assembly 4 is connected, and the annular frame providing assembly 4 is used to accommodate a plurality of figure 2 Ring frame 2 with opening 3 shown.

[0042] figure 2 The illus...

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Abstract

In a processing method, a surface protective tape peeling step of peeling a surface protective tape (T) off the top surface (Wa) of a wafer (W) is performed in a state in which an expanding sheet (8)is expanded while a preliminary expanding step of expanding the expanding sheet (8) is performed after an affixing step is performed. Therefore, the surface protective tape (T) can be peeled off the top surface (Wa) of the wafer (W) while a tension is applied to the expanding sheet. It is thereby possible to prevent chips from coming into contact with each other and being damaged. When an expanding step is thereafter performed, the expanding sheet (8) is expanded by an amount of expansion which amount is a value larger than an amount of expansion of the expanding sheet in the preliminary expanding step. Thus, sufficient intervals can be formed between the chips (C), and the chips (C) can be transported smoothly.

Description

technical field [0001] The present invention relates to a method for processing a workpiece, which is a workpiece having a division starting point formed along a plurality of intersecting planned division lines and a front protective tape attached to the front surface, or a workpiece along a plurality of intersecting planned division lines. The to-be-processed object which is divided into individual chips by the planned dividing line and has the front surface protection tape attached to the front surface. Background technique [0002] A workpiece such as a wafer has devices formed in regions divided by grid-shaped planned dividing lines on the front surface, and is divided along the planned dividing lines to be divided into individual device chips having devices. As a method of dividing a workpiece into individual device chips, a method of irradiating a laser beam with a wavelength that is transparent to the workpiece to form a modified layer inside the workpiece, and then a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/683H01L21/78
CPCH01L21/67132H01L21/6836H01L21/78H01L2221/68336H01L21/67092H01L2221/68327H01L2221/68386H01L21/76B32B2457/14B32B43/006
Inventor 卡尔·普利瓦西尔木川有希子
Owner DISCO CORP
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