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LED lamp wick

A technology of LED wick and LED patch, which is applied to lighting devices, cooling/heating devices of lighting devices, light sources, etc., can solve problems such as poor heat dissipation effect, unreasonable heat dissipation structure of LED wick, affecting product life and quality, etc. To achieve the effect of improving the cooling effect

Pending Publication Date: 2018-12-07
德清鼎辉照明有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In contrast, LED wicks need to pay more attention to heat dissipation requirements compared with tungsten lamps, but the current heat dissipation structure of LED wicks is unreasonable, and the heat dissipation effect is not good, which will directly affect the life and quality of the product

Method used

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  • LED lamp wick
  • LED lamp wick
  • LED lamp wick

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] like Figure 1~3 The shown LED patch wick includes a heat dissipation support 1 , an LED patch assembly 2 arranged on the heat dissipation support 1 , and a sealed horn body 3 for supporting the heat dissipation support 1 . Wherein, the sealing horn body 3 is used to connect and seal the inner cavity opening of the bulb, and at the same time is used to support the heat dissipation bracket 1 and the LED patch assembly 2 on it.

[0023] The heat dissipation bracket 1 at least includes a cone portion 11 and a sleeve portion 12 below the cone portion 11 . like figure 2 and 3 As shown, in one embodiment, the heat dissipation support 1 is a ceramic support. like figure 1 As shown, in another embodiment, the heat dissipation support 1 is a metal support, and the metal used in the metal support can be heat-conducting metals such as aluminum and copper. 13 cooling slots. On the basis of the above two implementations, the inside of the cooling support 1 is provided with a...

Embodiment 2

[0029] like Figure 1~4 As shown, this embodiment relates to a bulb lamp, including a bulb housing 5 , an LED chip wick disposed on the bulb housing 5 , and a conductive base 6 connected to the bulb housing 5 . Described LED chip wick adopts LED chip wick as described in embodiment 1. Specifically, the LED patch wick includes a heat dissipation support 1 , an LED patch assembly 2 arranged on the heat dissipation support 1 , and a sealed horn body 3 for supporting the heat dissipation support 1 . Wherein, the sealing horn body 3 is used to connect and seal the inner cavity opening of the bulb, and at the same time is used to support the heat dissipation bracket 1 and the LED patch assembly 2 on it. The sealing horn body 3 is sealed on the cavity opening of the bulb housing 5 , and the heat dissipation bracket 1 and the LED patch assembly 2 on it are located in the cavity of the bulb housing 5 .

[0030]The heat dissipation bracket 1 at least includes a cone portion 11 and a s...

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PUM

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Abstract

The invention relates to the field of LEDs, in particular to an LED lamp wick. The LED lamp wick comprises a heat dissipation support and an LED paster assembly arranged on the heat dissipation support. The heat dissipation support is a metal support, and comprises a conical portion and a sleeved connection portion connected to the bottom of the conical portion. Multiple heat dissipation grooves are regularly formed in the outer side wall in the circumferential direction of the sleeved connection portion of the heat dissipation support. By means of the LED lamp wick, the heat dissipation effect can be greatly improved, and heat can be rapidly carried to a bulb to be dissipated.

Description

technical field [0001] The invention relates to the field of LEDs, in particular to an LED wick. Background technique [0002] LED is the abbreviation of English light emitting diode (light emitting diode). It is a solid-state semiconductor device. The heart of the LED is a semiconductor chip. One end of the chip is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply. Encapsulate the entire chip with epoxy resin. Its main function is to convert electrical energy into light energy, and the main material of the chip is monocrystalline silicon. Semiconductor wafer is made up of two parts, and a part is P-type semiconductor, and hole occupies an leading position in it, and the other end is N-type semiconductor, and here mainly is electron. But time these two kinds of semiconductors couple together, between them, just form a P-N junction. When electric current acts on this chip by lead wire, electron will...

Claims

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Application Information

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IPC IPC(8): F21K9/232F21V29/70F21V29/503F21V19/00F21Y115/10F21Y107/40
CPCF21K9/232F21V19/0025F21V29/503F21V29/70F21Y2115/10F21Y2107/40
Inventor 钟建华傅根生
Owner 德清鼎辉照明有限公司