Ring oscillator based TSV fault test device and method

Abstract

The invention discloses a ring oscillator based TSV fault test device and method. The device comprises n odd number of sequentially connected inverters, a multipath selector, a Schmitt trigger and anNAND gate, the Schmitt trigger and NAND gate connected sequentially are arranged between the first and second inverters, the multipath selector is arranged between the last inverter and the first inverter, the above parts form a closed loop, and a formed TSV in the ring oscillator structure is connected between the first inverter and the Schmitt trigger. The method comprises that 1) a TSV test mode is activated; 2) a fault-free TSV Monte Carlo period is tested; 3) a Monte Carlo period of the TSV under an open-circuit fault is obtained; 4) a period difference DeltaT is obtained; 5) a sum of square is obtained from the period difference DeltaT in each column; 6) a root value of the sum of square of the period difference DeltaT in each column is calculated; and 7) a function is fit, and testis completed. The test device is low in cost, convenient to use and flexible in operation. The test method is short in test time and high in test precision.

Description

technical field [0001] The invention relates to signal integrity testing technology, in particular to a TSV fault testing device and testing method based on a ring oscillator. Background technique [0002] Three-dimensional integrated circuits are developing in the direction of high integration, low power consumption, and low cost. As a new way of three-dimensional integrated interconnection, TSV has also been put forward higher requirements. Due to the complexity of the TSV manufacturing process, defects will inevitably appear in the process of manufacturing TSVs. In order to improve the yield of 3D integrated chips, defect-free TSVs become very important. Then test the defective TSVs and analyze the defects. Therefore, it becomes more important to improve the manufacturing process of TSV. The traditional TSV test method is the probe test method. Due to the density of TSVs and the small spacing between TSVs, it is difficult to test a single TSV with a probe. In addition, t...

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Problems solved by technology

The traditional TSV test method is the probe test method. Due to the density of TSVs and the small spacing between TSVs, it is difficult to test a single TSV with a probe. In addition, the size of TSV is very small and very fragile. During the needle test, the mechanical stress of the probe may cause damage to the TSV, which violates the original intention of the probe test

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