Cooling device

Abstract

The present invention relates to a cooling device. The cooling device comprises: a pedestal comprising an absorber plate made of metal materials and configured to put electronic products, wherein theabsorber plate is internally provided with an absorber plate flow channel configured to allow a cooling medium to flow through; a cooling main body connected with the pedestal, wherein the cooling main body comprises a housing, a first cooler and a cooling fan which arranged in the housing, the first cooler comprises a first cooling substrate, the first cooling substrate is internally provided with a first cooling flow channel configured to allow the cooling medium to flow through, and the absorber plate flow channel is connected with the first cooling flow channel through a pipeline to form acooling medium circulation loop which is provided with a fluid pump. The cooling device employs the absorber plate, the first cooling plate in the cooling main body forms the cooling medium circulation loop, and therefore, the cooling efficiency is higher, and the user experience is improved.

Description

technical field [0001] The present invention relates to a heat dissipation device, more specifically, to a heat dissipation device for electronic products. Background technique [0002] Electronic products, such as mobile phones, tablet computers, notebook computers, etc., on the one hand, are becoming thinner and thinner, and more and more fanless designs are used; on the other hand, with the increasing performance of electronic products, their internal The number of cores of central processing unit (CPU) and graphics processing unit (GPU) is increasing, and the frequency is getting higher and higher, and the heat generation is also increasing, which brings a huge challenge to the heat dissipation design of electronic products. Although more and more electronic products use metal shells to dissipate heat, when running games or other software that requires more calculations, there will still be cases of freezes or even crashes due to overheating, which will cause users Very...

AI Technical Summary

Problems solved by technology

Although more and more electronic products use metal shells to dissipate heat, when running games or other software that requires more calculations, there will still be cases of freezes or even crashes due to overheating, which will cause users very bad experience

In order to help the heat dissipation of electronic products, there are also some auxiliary heat dissipation devices, such as some heat dissipation bases that use fans to cool electronic products. These heat dissipation bases have low heat dissipation efficiency and are only effective when the ambient temperature is low.

Images