Quantum chip package device

Abstract

The present invention belongs to the field of chip package, and especially discloses a quantum chip package device. The quantum chip package device comprises: an electromagnetic shielding package boxconfigured to horizontally putting a quantum chip to be packaged and having an electromagnetic shielding effect; and a magnetostatic shielding cover coating the external portion of the electromagneticshielding package box and having a magnetostatic shielding effect. For the demand for the severe work environment of the quantum chip, the present invention provides a quantum chip package device with two layers of shielding structures, wherein the two layers of shielding structures are the electromagnetic shielding package box having the electromagnetic shielding effect and the magnetostatic shielding cover having the magnetostatic shielding effect coating the external portion of the electromagnetic shielding package box, the layers of the shielding structures work together to achieve shielding of different types of magnetic fields and magnetic fields with different intensities so as to commonly guarantee the work environment of the quantum chip to be packaged in the electromagnetic shielding package box.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, in particular to a quantum chip packaging device. Background technique [0002] The three-dimensional packaging technology is widely used in the packaging of quantum chips because it can lead out the signal on the quantum chip through the third vertical dimension. It can accommodate more quantum elements without expanding the size of the quantum chip, and at the same time , the size of the packaging box can be reasonably adjusted according to the size of the quantum chip, so that the redundant space around the quantum chip can be compressed as much as possible, the spatial standing wave mode can be improved, and the interference between the spatial standing wave and the quantum element can be avoided. [0003] Due to the harsh working conditions of the quantum chip, a good working environment such as extremely low working temperature and effective noise shielding is required. In the prior ...

AI Technical Summary

Problems solved by technology

[0004] In this prior art, only a shielding barrel structure made of aluminum alloy 6061 is used as the packaging box structure for magnetic field radiation noise. When this structure is used, it can only realize the shielding of electromagnetic radiation noise, and cannot realize the shielding including static magnetic field.

In addition, coating the infrared radiation shielding layer on the inner wall of the shielding bucket in this publication will have a negative impact on the skin effect of electromagnetic shielding on the inner surface of the shielding bucket, thereby affecting the shielding effect, and cannot effectively ensure the working environment of the quantum chip to be packaged.

Images