Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

System-in-package module and terminal equipment

A technology of system-level packaging and plastic packaging, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the complex dispensing process, poor interference shielding effect of packaging modules and external electronic components, and affect the shielding layer Covering effects and other issues to achieve the effect of ensuring the shielding effect and solving mutual electromagnetic interference

Active Publication Date: 2020-01-17
HUAWEI MACHINERY
View PDF6 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the above-mentioned related technologies, the setting of the inner shield can make the electronic components have low electromagnetic interference and high electromagnetic tolerance. However, the inner shield needs to be formed by filling the groove with conductive glue. The conductive glue has poor fluidity and is not easy to fill the groove. Groove, the dispensing process is complicated, and defects such as voids and delamination are prone to occur, which not only affects the shielding effect of the inner shield, but also makes the shielding effect of the mutual electromagnetic interference between the electronic components inside the system-in-package module poor, and affects the shielding layer. The coverage effect makes the interference shielding effect between the packaged module and external electronic components poor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • System-in-package module and terminal equipment
  • System-in-package module and terminal equipment
  • System-in-package module and terminal equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] figure 1 is a schematic diagram of a partial cross-sectional structure of the system-in-package module provided in Embodiment 1 of the present application, figure 2 is a schematic diagram of the three-dimensional structure of the system-in-package module provided in Embodiment 1 of the present application, image 3 It is a schematic top view of the system-in-package module provided in Embodiment 1 of the present application, refer to Figure 1-Figure 3 As shown, Embodiment 1 of the present application provides a system-in-package module.

[0063] The system-in-package module provided by Embodiment 1 of the present application includes: a substrate 10 , at least two electronic components 20 , a plastic package 30 , a slot 40 , a conductive shielding layer 50 and a filler 60 . At least two electronic components 20 are disposed on the substrate 10 . The plastic package 30 is located on the substrate 10 and covers the surface of the substrate 10 , and at least two elect...

Embodiment 2

[0105] The system-in-package module provided by Embodiment 2 of the present application includes: a substrate 10 , at least two electronic components 20 , a plastic package 30 , a slot 40 , a conductive shielding layer 50 and a filler 60 . At least two electronic components 20 are disposed on the substrate 10 . The plastic package 30 is located on the substrate 10 and covers the surface of the substrate 10 , and at least two electronic components 20 are wrapped in the plastic package 30 . The slot 40 runs through the upper and lower surfaces of the plastic package 30 and takes the route between two adjacent electronic components 20 as a cutting path, or the slot 40 is located between two adjacent electronic components 20 . The conductive shielding layer 50 covers the upper surface of the plastic package 30 and the inner surface of the slot 40 . The filling body 60 fills the slot 40 .

[0106] Figure 11 is a schematic diagram of a partial cross-sectional structure of the sy...

Embodiment 3

[0130] Embodiment 3 of the present application provides a terminal device, including: the system-in-package module described in Embodiment 1 and Embodiment 2 above.

[0131] The terminal devices involved in Embodiment 3 of the present application may include electronic devices such as mobile phones, watches, tablet computers, personal digital assistants (Personal Digital Assistant, PDA), sales terminals (Point of Sales, POS), and vehicle-mounted computers.

[0132] The terminal equipment provided in this embodiment adopts a system-in-package module. The system-in-package module can solve the mutual electromagnetic interference between electronic components inside the system-in-package module by setting surface shielding and sub-cavity shielding. Solve the interference between the system-in-package module and external electronic components, realize the electromagnetic shielding effect between the internal electronic components to reach 20-30dB, and the electromagnetic shielding ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Sizeaaaaaaaaaa
Sizeaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides a system-in-package module and terminal equipment. The system-in-package module comprises a substrate, at least two electronic components, a plastic package body, an open groove, a conductive shielding layer and a filling body, wherein the at least two electronic components are arranged on the substrate; the plastic package body is located on the substrate and wraps the at least two electronic components, the open groove penetrates through the upper surface and the lower surface of the plastic package body and is located between the two adjacent electronic components, the conductive shielding layer covers the upper surface of the plastic package body and the inner surface of the open groove, and the open groove is filled with the filling body. The invention providesthe system-in-package module and the terminal equipment. The electromagnetic shielding effect between electronic components in the system-in-package module and the electromagnetic shielding effect between the system-in-package module and external electronic components can be improved.

Description

technical field [0001] The present application relates to the technical field of electronic equipment, in particular to a system-in-package module and terminal equipment. Background technique [0002] System-in-Package SIP (System In Package) integrates multiple functional chips and components into one package to achieve a complete function. SIP is a new type of packaging technology, which has the advantages of short development cycle, more functions, lower power consumption, better performance, lower cost and price, smaller volume and light weight. For complex SIP packages, the radio frequency and the main chip are integrated together, and the subsystems inside the package will also interfere with each other electromagnetically, so electromagnetic isolation must be carried out inside the package. [0003] In related technologies, the main method of electromagnetic isolation inside the package is to use sub-cavity shielding. There are several electronic components on the su...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L23/552H01L23/31H01L23/29H01L25/16
CPCH01L23/552H01L23/3121H01L23/29H01L25/16H01L2924/3025
Inventor 胡彬蒋然卿湘勇
Owner HUAWEI MACHINERY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com