System-in-package module and terminal equipment
A technology of system-level packaging and plastic packaging, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the complex dispensing process, poor interference shielding effect of packaging modules and external electronic components, and affect the shielding layer Covering effects and other issues to achieve the effect of ensuring the shielding effect and solving mutual electromagnetic interference
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Example Embodiment
[0061] Example 1
[0062] figure 1 is a schematic diagram of a partial cross-sectional structure of the system-in-package module provided in the first embodiment of the present application, figure 2 is a schematic three-dimensional structure diagram of the system-in-package module provided in the first embodiment of the present application, image 3 This is a schematic top view of the system-in-package module provided in the first embodiment of the present application. Refer to Figure 1-Figure 3 As shown, the first embodiment of the present application provides a system-in-package module.
[0063] The system-in-package module provided in the first embodiment of the present application includes: a substrate 10 , at least two electronic components 20 , a plastic packaging body 30 , a slot 40 , a conductive shielding layer 50 and a filling body 60 . At least two electronic components 20 are arranged on the substrate 10 . The plastic sealing body 30 is located on the substra...
Example Embodiment
[0104] Embodiment 2
[0105] The system-in-package module provided in the second embodiment of the present application includes: a substrate 10 , at least two electronic components 20 , a plastic packaging body 30 , a slot 40 , a conductive shielding layer 50 and a filling body 60 . At least two electronic components 20 are arranged on the substrate 10 . The plastic sealing body 30 is located on the substrate 10 and covers the surface of the substrate 10 , and at least two electronic components 20 are encapsulated in the plastic sealing body 30 . The slot 40 runs through the upper and lower surfaces of the plastic package 30 and takes a route between two adjacent electronic components 20 as a cutting path, or the slot 40 is located between two adjacent electronic components 20 . The conductive shielding layer 50 covers the upper surface of the plastic package 30 and the inner surface of the slot 40 . The filling body 60 is filled in the slot 40 .
[0106] Figure 11 It is ...
Example Embodiment
[0129] Embodiment 3
[0130] Embodiment 3 of the present application provides a terminal device, including: the system-in-package module as described in Embodiment 1 and Embodiment 2 above.
[0131] The terminal device involved in the third embodiment of the present application may include electronic devices such as a mobile phone, a watch, a tablet computer, a personal digital assistant (Personal Digital Assistant, PDA), a point of sale (Point of Sales, POS), a vehicle-mounted computer, and the like.
[0132] The terminal device provided in this embodiment adopts a system-in-package module. The system-in-package module can solve the mutual electromagnetic interference between electronic components inside the system-in-package module by setting surface shielding and cavity shielding, and can also Solve the interference between the system-in-package module and external electronic components, and realize the electromagnetic shielding effect between internal electronic components...
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