Heat-curable conductive paste, use thereof and solar cell
A conductive paste, heating and curing technology, applied in the field of solar cells, can solve the problems of low-resistivity conductive film, non-compliance, and inability to meet process requirements, etc., and achieve the effect of high conductivity
Active Publication Date: 2018-12-11
CHANGZHOU JUHE NEW MATERIAL CO LTD
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Problems solved by technology
[0011] Japanese Patent Document No. 5819712 mentions a composition cured by heating in the range of 100-300°C, but the curing time must reach 60 minutes, which does not meet the above requirements
[0012] Japanese Patent Document No. 5859823 also mentions a composition for heating and curing the conductor pattern on the substrate in the range of 150-250° C. to form electrodes and wiring on the substrate, but it needs to be dried by hot air for 60 minutes. does not meet the above requirements
[0013] Japanese Patent Document No. 5916633 mentions a conductive paste that can be heat-treated at a low temperature below 200°C and can obtain a conductive film with a very low resistivity, but this also requires a curing time of 30 minutes, which cannot meet the above requirements
[0014] Japanese patent document No. 8-92506 mentions electrode materials for solar cells, which can be heated and cured in the range of 150-200 ° C to form an electrode composition, but because it requires a curing time of 20-90 minutes, it is still unsatisfactory. The above process requirements
Method used
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Embodiment
[0071] 1, the preparation of embodiment and comparative example sample
[0072] According to the formula of Example 1 in the following table 1, the heat-curable conductive paste was prepared according to the following method:
[0073] (1) Mix epoxy resin, polyisocyanate compound, and DBE solvent in a ratio of 2.5:2:2.68, stir and heat to 80°C, keep it warm for 2 hours, and after the solution is clarified, filter and cool to room temperature, Obtain the dissolved resin solution, and place it in an airtight container for subsequent use;
[0074] (2) Preparation of conductive powder:
[0075] a, the conductive powder in embodiment 1 is to select the spherical silver powder with a particle diameter of 1.5 μm as the base powder, take out 41% of the spherical powder and use a three-roll machine to grind it thinly until the particle diameter increases to 10 μm, and then mix with it The remaining 59% of the spherical powder was mixed to obtain an integrated conductive powder.
[00...
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Abstract
The invention discloses a heat-curable conductive paste, comprising a conductive powder, a thermosetting component, a curing agent and a solvent, wherein the conductive powder is a conductive powder with a bimodal particle size distribution, and the first peak value of the particle size distribution of the conductive powder is 0.1-2 microns, with a second peak is 5-20 microns, the intensity ratioof the first peak to the second peak is in the range of 1: 2 to 2: 1. The conductive paste is prepared from a spherical powder having a single peak particle size distribution as a raw material. The heat-curable conductive paste of the present invention is capable of evaporating and removing solvent within 10 minutes at 160 DEG C or less and completing the curing process within 5 minutes at 180 DEGC, so that an electrode having high conductivity can be prepared from the heat-curable conductive paste composition.
Description
technical field [0001] The present invention mainly relates to a heat-curable conductive paste composition, and more specifically, to a heat-curable conductive paste capable of forming highly conductive electrodes and wiring by heating and curing a coating film formed by printing on a substrate Composition, its use and solar cell comprising it. Background technique [0002] Currently, the technique of conductive paste composition is widely used to form electrodes, wiring, etc. on substrates such as films, substrates, and electronic parts. [0003] When using this technique to form conductive patterns at relatively low temperatures, conductive metal powder (conductive particles) and heat-curable materials containing thermosetting resins are also used. In addition, the above-mentioned heat-curable conductive paste composition should be coated or printed on the substrate to form a selected conductor pattern (pattern forming step), and then the conductor pattern on the substrat...
Claims
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IPC IPC(8): H01B1/20H01B1/22H01L31/02H01L31/0224
CPCH01B1/20H01B1/22H01L31/02008H01L31/022425Y02E10/50
Inventor 冈本珍范万莉刘海东敖毅伟
Owner CHANGZHOU JUHE NEW MATERIAL CO LTD