A reaction chamber cavity based on an aerodynamic configuration of a plasma etcher

Abstract

The invention discloses a reaction chamber cavity based on the pneumatic configuration of a plasma etching machine. The cavityinclude a cavity, a mounting baseand a chamber door, A first mounting plate and a second mounting plate are respectively arranged at one end of both sides of the cavity, the two ends of the second mounting plate and the two ends of the first mounting plate are respectivelyrotatably connected with the two sides of one end of the cavity door through rotary joints, both chambers have viewing windows in the middle, according to the invention, the processing gas of the device is diverted once through the cloth pipe, uniformly distribute in the lower groove and the two sides of the product, the by-product of the reaction product and the non-ionized gas are diverted for the second time through the side plate of the rectangular box on the bottom surface of the cavity, and then are diverted for the third time through the diameter-changing pipe on the outside of the bottom surface of the cavity. The aerodynamic configuration can effectively ensure that the process gas is uniformly distributed in each tank and on both sides of the processed product, so that the gas flow and ions in the reaction chamber are stably exchanged, and the reaction is stable, uniform and free of plain flow.

Description

technical field [0001] The invention relates to a reaction chamber cavity, in particular to a reaction chamber cavity based on the pneumatic layout of a plasma etching machine, and belongs to the technical field of etching machines. Background technique [0002] Etching is usually also called photochemical etching, which refers to removing the protective film of the area to be etched after developing, and contacting chemical solution during etching to achieve the effect of dissolution and corrosion. At present, most of the etching machines on the market are spray etching machines. The type etching machine is equipped with an etching spray device, and the top of the fuselage is a plane structure, and the front and back sides of the workpiece are etched by the spray device. [0003] When the traditional device is in use, there will be gas turbulence inside the device, which is not conducive to the normal use of the device; at the same time, when the traditional device is insta...

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Problems solved by technology

[0004] The object of the present invention is to provide a reaction chamber cavity based on the pneumatic layout of a plasma etching machine to solve the problem of inconvenient use in the above-mentioned background technology

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