A preparation method of a printing thimble template and a printing thimble template

A production method and technology of thimbles, which are applied in the fields of printed circuit manufacturing, printed circuits, printed circuits assembled with electric components, etc., can solve the problems of inaccurate layout position, low efficiency of thimbles, and low product reliability, and solve the problem of easy concentration of stress , Improve work efficiency and improve reliability

Active Publication Date: 2018-12-11
5 Cites 4 Cited by

AI-Extracted Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the low efficiency of manually arranging thimble...
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Method used

At least 5 times of stress test gained stress-strain value maximum value is less than 400 μ ε, get rid of abnormal sample data, make test more accurate.
Compared with embodiment 2 and embodiment 3, adopt the form of work instruction book, be more convenient for the management of printing thimble template.
The thimble should avoid electrical element mounting holes and the fire trough on the PCB to prevent damage to the mountin...
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The invention provides a manufacturing method of a printed thimble template, comprising the following steps: S1. confirming a first arrangement position on a PCB board consistent with the thimble distribution; S2. Stress simulation is performed on the first arrangement position, a second arrangement position is selected, a plurality of thimbles are arranged below the second arrangement position, and a printing thimble template produced according to the printing thimble template method is provided. The invention relates to a printing thimble stencil making method, the pre-fabricated printed thimble template is one-to-one matched with the PCB board to be printed, In addition, the position of the thimble arrangement on the PCB in the invention has accurately measured the stress and strain amount thereof, effectively preventing the damage of components or solder joints on the PCB caused by the printing process, and improving the reliability of the product.

Application Domain

Printed circuit assemblingCircuit board tools positioning

Technology Topic

Computer engineering


  • A preparation method of a printing thimble template and a printing thimble template
  • A preparation method of a printing thimble template and a printing thimble template
  • A preparation method of a printing thimble template and a printing thimble template


  • Experimental program(5)

Example Embodiment

[0055] Example 1
[0056] This embodiment provides a method for making a printing thimble template in the present invention, which specifically includes:
[0057] S1. Confirm that the first layout position on the PCB is consistent with the distribution of ejector pins;
[0058] S2. Perform stress simulation on the first arrangement position, select a second arrangement position, and arrange several thimbles under the second arrangement position.
[0059] In step S1, the process of determining the first arrangement position is as follows:
[0060] First determine the thickness of the PCB board, set the thickness of the PCB board as b, and the connection distance between two adjacent and nearest thimbles as c, and then the thimble layout needs to meet:
[0061] When 0mm
[0062] When 1mm
[0063] When 1.6mm
[0064] If there are many electrical components on the PCB, the value of the thimble spacing c in the actual layout is relatively large, which cannot meet the above-mentioned theoretical requirements for the thimble spacing c. In this case, it can be increased on the basis of the original thimble spacing c. (0 , 20] mm, to achieve the thimble layout of as many PCB boards as possible.
[0065] Then confirm the type of PCB board. If the PCB board has multiple sub-boards that are spliced ​​with each other, at least one thimble is arranged under each sub-board to prevent the lack of support of the sub-board from causing the overall PCB board to split under force. .
[0066] Finally, the first arrangement position needs to satisfy:
[0067] There is no interference between the thimble and the bottom surface components of the PCB board, so as to prevent damage to the bottom surface electrical components when the thimble is arranged;
[0068] The thimble should avoid the electrical component mounting holes and fire-discharging grooves on the PCB to prevent damage to the mounting holes and fire-discharging grooves;
[0069] The first and last ends of the PCB along the printing direction are respectively provided with thimbles;
[0070] The vertical distance between the uppermost end of the thimble and the silk screen frame of the bottom component of the PCB is a, 0mm
[0071] In step S2, the selection of the second position satisfies the following test conditions:
[0072] The stress simulation test refers to performing a stress-strain test on the SMD components and solder joints with a diameter of at least 5mm around each thimble, and the measured stress-strain value is the shape produced after the PCB board is stressed during the printing process. The ratio of the variable to the original size.
[0073] The stress simulation test process includes: a stress-strain tester, on which a strain gauge is connected, the stress-strain tester is connected, the strain gauge is pasted on the chip component to be tested and the solder joint, and the pasted The PCB board of the above-mentioned strain gauge is installed on the fixed frame body, and the circuit is arranged; the supporting test bench simulates the solder paste printing process and records the stress and strain generated by the SMD component and the solder joint to be tested through the StrainMaster real-time acquisition software.
[0074] Described stress-strain value is the average value of the stress-strain value that at least 5 times of stress tests obtain, and gained stress-strain value during test is more better, to improve the accuracy of test.
[0075] The maximum value of the stress and strain values ​​obtained from at least 5 stress tests is less than 400με, and the abnormal sample data is removed to make the test more accurate.

Example Embodiment

[0076] Example 2

Example Embodiment

[0077] like figure 2 and 3 As shown, the present embodiment provides an implementation of the printing ejector pin template described in the present invention, including:
[0078] The SMT printing thimble template 1 made by the printing thimble template manufacturing method in Embodiment 1 is specifically provided with a thimble arrangement hole 11 on the PCB, and a thimble 2 is arranged directly below the thimble arrangement hole 11.
[0079] The thimble 2 in the present embodiment is formed with the supporting portion 21 of small diameter and the fixed portion 22 of large diameter, and magnetite is installed on the fixed portion 22, and the diameter of described thimble arrangement hole 11 gets final product larger than the diameter of supporting portion 21, guarantees that the worker When the thimble 2 is moved, the position of the thimble 2 can be seen through the thimble arrangement hole 11 .
[0080] During specific implementation, when switching lines in the PCB board printing solder paste process, the SMT printing thimble template 1 is first installed on the position of the PCB board to be printed, and several thimbles 2 are arranged below, which are adsorbed by the magnet in the fixing part 22 On the thimble mounting plate 3, according to the positions of the thimble arrangement holes 11 on the SMT printing thimble template 1, manually overcome the suction force of the magnet and move several thimbles 2 to the bottom of the several arrangement holes 11 to complete the arrangement of the thimbles 2.


Diameter>= 5.0mm

Description & Claims & Application Information

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