A preparation method of a printing thimble template and a printing thimble template
A production method and technology of thimbles, which are applied in the fields of printed circuit manufacturing, printed circuits, printed circuits assembled with electric components, etc., can solve the problems of inaccurate layout position, low efficiency of thimbles, and low product reliability, and solve the problem of easy concentration of stress , Improve work efficiency and improve reliability
Active Publication Date: 2018-12-11
CHANGSHA GREE HVAC EQUIP CO LTD +1
5 Cites 4 Cited by
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Abstract
The invention provides a manufacturing method of a printed thimble template, comprising the following steps: S1. confirming a first arrangement position on a PCB board consistent with the thimble distribution; S2. Stress simulation is performed on the first arrangement position, a second arrangement position is selected, a plurality of thimbles are arranged below the second arrangement position, and a printing thimble template produced according to the printing thimble template method is provided. The invention relates to a printing thimble stencil making method, the pre-fabricated printed thimble template is one-to-one matched with the PCB board to be printed, In addition, the position of the thimble arrangement on the PCB in the invention has accurately measured the stress and strain amount thereof, effectively preventing the damage of components or solder joints on the PCB caused by the printing process, and improving the reliability of the product.
Application Domain
Printed circuit assemblingCircuit board tools positioning
Technology Topic
Computer engineering
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PUM
Property | Measurement | Unit |
Diameter | >= 5.0 | mm |
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