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Online coating mechanism of RFID tag bonding machine and using method of online coating mechanism

A technology of RFID tags and lamination mechanisms, applied in the field of RFID tags, can solve the problems of chip and antenna connection disconnection, internal circuit breakage, chip breakage, etc., to achieve the effect of improving life and reliability, controlling costs, and improving impact resistance.

Inactive Publication Date: 2018-12-18
ARIZON RFID TECH YANGZHOU
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the performance test and the finished product winding process, the chip is exposed, and it is kept connected to the antenna by the cured glue. There are no other protection measures, and it is easily damaged by external forces in the post-production process. The chip itself is cracked, the internal circuit is broken, or the chip The connection between the antenna and the antenna has problems such as open circuit or poor release

Method used

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  • Online coating mechanism of RFID tag bonding machine and using method of online coating mechanism
  • Online coating mechanism of RFID tag bonding machine and using method of online coating mechanism
  • Online coating mechanism of RFID tag bonding machine and using method of online coating mechanism

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Embodiment Construction

[0029] An RFID label bonding machine online lamination mechanism, including a frame 1 and a discharge shaft 2 connected to the frame, a waste collection shaft 3, a number of guide wheels, a pair of lamination pressing rollers 4, and the discharge shaft is placed in a Above the lamination pressing rollers, the waste collection shaft is placed on one side of the discharge shaft, and among a pair of lamination pressing rollers, the upper roller is connected with a cylinder 13, which can control the pressing and separation of the two rollers. A protective film 5 is wound on the discharge shaft. After the initial end of the protective film is guided by a number of guide wheels, the film body 6 at the initial end of the protective film is separated from the bottom paper 7. The separated bottom paper is wound on the waste collection shaft and separated. The final film body and the RFID tag are placed between a pair of laminating rollers for lamination to complete the lamination on the...

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Abstract

The invention discloses an online coating mechanism of a RFID tag bonding machine and a using method of the online coating mechanism, and belongs to the technical field of RFID tags. According to theonline coating mechanism of the RFID tag bonding machine and the using method of the online coating mechanism, after chip bonding is completed, a protective film is additionally arranged on the surface of the chip to improve the impact resistance of the chip, so that the service life of existing products is prolonged, and the reliability of the products is improved. The coating mechanism is designed on an existing Bonding machine and is improved, so that the coating function is achieved without affecting the Bonding efficiency, and the mechanism with the coating function is obtained; and the position of the coating mechanism and the position of a performance testing or winding process device can be exchanged freely, so that the coating function is achieved in the Bonding process, and accordingly, the reliability of the chip is greatly improved while the cost is effectively controlled.

Description

technical field [0001] The invention relates to an online laminating mechanism of an RFID tag bonding machine and a method for using the same, belonging to the technical field of RFID tags. Background technique [0002] RFID: (Radio Frequency Identification) technology, also known as radio frequency identification, is a communication technology that can identify specific targets through radio signals and read and write related data without the need for mechanical or optical contact between the identification system and specific targets. Bonding: A packaging method that realizes the conduction and connection of the chip and the antenna substrate without falling off by pressurizing and heating the conductive adhesive. [0003] At present, the conventional bonding technology in the RFID industry is to use the bonding machine to form the RFID tag antenna and the chip through the action of temperature and pressure to form a label, and then conduct a performance test and then wind...

Claims

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Application Information

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IPC IPC(8): B65B33/02B65B41/16B65H23/26B65H19/12B65H19/18B65H19/20B65H23/198G06K19/077
CPCB65B33/02B65B41/16B65H19/12B65H19/18B65H19/20B65H23/1955B65H23/198B65H23/26B65H2701/1133B65H2701/1752G06K19/0772
Inventor 马跃伟
Owner ARIZON RFID TECH YANGZHOU
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