Improved SSORPCG parallel method based on domain decomposition of finite element for solving temperature field

A domain decomposition, finite element technology, applied in the direction of instrumentation, calculation, design optimization/simulation, etc., can solve problems such as not suitable for parallel solution, and achieve the effect of avoiding restrictions

Active Publication Date: 2018-12-18
HOHAI UNIV
View PDF3 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Han Lin and others published the article "Application of improved algorithm for symmetric step-by-step over-relaxation preconditioning conjugate gradient method for mass concrete simulation calculation" in the Journal of Hohai University (Natural Science Edition), 2010(03):278-283. Chunyu et al. published an article "The Practice of Improved SSOR-PCG Fast Solution Method in Solving Efficiency and Saving Memory of High Concrete Face Rockfill Dam" in Hydropower Energy Science, 2014(09):90-93. The improved SSORPCG solution method, but these improved methods are not suitable for parallel solution

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Improved SSORPCG parallel method based on domain decomposition of finite element for solving temperature field
  • Improved SSORPCG parallel method based on domain decomposition of finite element for solving temperature field
  • Improved SSORPCG parallel method based on domain decomposition of finite element for solving temperature field

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0053] The present invention will be further described below in conjunction with the accompanying drawings. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0054] The invention proposes a parallel method for solving temperature field by improving SSORPCG by finite element domain decomposition. This method decomposes the finite element model serially and merges the results, and performs parallel calculations in the middle process. The specific calculation flow chart is as attached figure 1 shown. It mainly includes five steps: (1) Establish a solution model, perform finite element discretization on the model, and obtain the structural information of the model, including the total number of units, unit information and node information; (2) Model area decomposition, according to the number of P processes and the number of processors Topological stru...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a parallel method for solving temperature field by improved SSORPCG of finite element domain decomposition, which comprises the following steps: (1) establishing a solution model, carrying out finite element discretization on the model, and obtaining structural information of the model; (2) dividing the model into a certain number by using domain decomposition method under serial computation, and distributing the unit information and message passing index of each partition; (3) the element heat conduction matrix, the contribution matrix of exothermic boundary to the heatconduction matrix and the element temperature load array being formed independently in each processor, thus the governing equation of finite element being formed; (4) improved SSORPCG solver being called to solve the temperature of each unknown node, and the temperature field of each partition being obtained; (5) the calculation results of the whole model being obtained. Advantages: the inventioncan effectively improve the ability of solving large-scale sparse coefficient matrix equation group of the temperature field, and can improve the quality and efficiency of the finite element analysisand parallel calculation of the temperature field.

Description

technical field [0001] The invention relates to a parallel method for solving temperature field by improving SSORPCG by finite element region decomposition, and belongs to the technical field of finite element engineering numerical simulation calculation and large-scale parallel calculation. Background technique [0002] In recent years, computers have continued to develop and progress at an astonishing rate, with great progress and remarkable results in computing performance. However, with the improvement of calculation scale and calculation accuracy, especially in data-intensive and calculation-intensive numerical analysis applications, the more frequent the use of finite element analysis, the performance of ordinary computers can no longer meet the needs of these fields. Looking for Efficient parallel algorithms have become one of the indispensable ways of current computing. [0003] In order to be able to solve the differential equation of heat conduction and obtain the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F2119/08G06F30/23
Inventor 赵兰浩彭大伟毛佳齐慧君李同春邵琳玉
Owner HOHAI UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products