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A heat dissipation assembly and a communication module

A heat-dissipating component and component technology, applied in electrical components, optical components, electrical equipment structural components, etc., can solve problems such as difficulty in maintaining a constant working temperature, poor heat dissipation, and affecting working performance, to avoid temperature fluctuations, The demand for high working power and the effect of improving product performance

Inactive Publication Date: 2018-12-18
CHENGDU SUPERXON COMM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved and the technical task proposed by the present invention are to improve the existing technology and provide a heat dissipation component to solve the situation that the heat dissipation structure in the current technology has heat back transmission, the heat dissipation effect is not good, and it is difficult to maintain a constant work The problem of temperature affecting working performance

Method used

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  • A heat dissipation assembly and a communication module
  • A heat dissipation assembly and a communication module
  • A heat dissipation assembly and a communication module

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Embodiment Construction

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0040] The heat dissipation component disclosed in the embodiment of the present invention realizes directional heat dissipation, ensures that the heat is effectively dissipated outward, avoids the situation of heat back transmission, ensures that the device is at a constant temperature, and ensures a stable working state.

[0041] Such as figure 1As shown, a heat dissipation assembly mainly includes a housing 1 and a heat generating device 2 arranged inside t...

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Abstract

The invention discloses a heat dissipation assembly, comprising a housing and a heating device arranged inside the housing, wherein, a heat insulation cavity wrapped around the periphery of the heating device is arranged in the housing, an opening is arranged on the heat insulation cavity, and a heat conduction assembly for conducting heat of the heating device to the housing through the opening is arranged in the housing. The heat dissipation component of the invention conducts heat of the heating device to the shell for heat dissipation at the same time, The heat insulation cavity is used toavoid the heat dissipated from the high-temperature shell to be transmitted back to the heating device, so as to ensure the good and stable heat dissipation effect, avoid the temperature fluctuation,ensure the working stability of the heating device, thereby ensuring the stable working performance of the electronic module and effectively prolonging the service life of the device.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic devices, in particular to a heat dissipation assembly and a communication module. Background technique [0002] Electronic devices usually generate a lot of heat when they work, but at the same time, electronic devices have high requirements for operating temperature. Excessive temperature will lead to abnormal operation and shortened service life of electronic devices, especially for communication optical modules. The constant requirements of the optical module are even more stringent. When the operating temperature rises, the emission intensity of the optical module will decrease with the increase of temperature, and the wavelength of the signal sent by the optical module will drift. Once the wavelength drifts, there will be some optical packet signals. When the signal is lost when passing through AWG / Demux, it will cause packet loss during the communication between ONU an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20436G02B6/4268G02B6/4261G02B6/4292G02B6/4271
Inventor 刘浪白庆邓江
Owner CHENGDU SUPERXON COMM TECH CO LTD