Interposer assemblies and arrangements for coupling at least one optical fiber to at least one optoelectronic device

Abstract

Interposer assemblies and arrangements for coupling at least one optical fiber to at least one optoelectronic device are disclosed. Interposer assemblies 10 comprise an interposer 100 including at least one optical waveguide 110 comprising a first end 111 and a second end 112, and a substrate 400 comprising the at least one optoelectronic device 410, at least one optical receiving / emitting element420 and at least one optical channel 430. The interposer 100 and the substrate 400 are in optical communication so that light coupled out of the at least one optical waveguide 110 is coupled in the at least one optical receiving / emitting element 420 and / or light coupled out of the at least one optical receiving / emitting element 420 is coupled in the at least one optical waveguide 110 of the interposer 100.

Description

[0001] Cross References to Related Applications [0002] This application claims priority under the Patents Act to US Provisional Application No. 62 / 302,438, filed March 2, 2016, which is incorporated herein by reference. technical field [0003] An interposer assembly for coupling at least one optical fiber to at least one optoelectronic device is disclosed, which can be integrated in a substrate, such as a SiP (Silicon Photonics) chip. Arrangements for coupling at least one optical fiber to at least one optoelectronic device and methods of fabricating the arrangements using the disclosed interposer assemblies are also disclosed. Background technique [0004] Optoelectronic devices, such as photonic integrated circuits (PICs), can be provided in substrates and fabricated by Silicon Photonics (SiP) technology. Silicon Photonics heralds many advantages of integrated optical circuits, but still suffers from the challenge of coupling light into and out of these photonic integr...

AI Technical Summary

Problems solved by technology

However, the mode field of a Si waveguide with a size of only a few hundred nanometers does not match that of a standard single-mode fiber (about 10 μm), thus requiring a 3D spot size converter for good coupling efficiency

To achieve low-loss coupling, these converters must be adiabatic, thus requiring a lot of space on the chip that includes the photonic integrated circuit, or on any additional chip, driving up the cost of the photonic integrated circuit and nullifying its compactness

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