Thick Film Pastes for Front Side Metallization in Silicon Solar Cells
A technology of solar cells and rare earth metals, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, metal/alloy conductors, circuits, etc. Major and other issues
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example 1
[0134] Glass frits made from rare earth metal oxides
[0135] Glass frits with the compositions listed in Table 1 were formed.
[0136] Table 1 Glass frit
[0137]
[0138] 1 The divalent lead oxide was from Alfa Aesar, product number 12220.
[0139] 2 Tetravalent tellurium oxide was obtained from Alfa Aesar, product number 87813.
[0140] 3 Trivalent bismuth oxide was obtained from Alfa Aesar, product number 44657.
[0141] 4 Hexavalent tungsten oxide was obtained from Alfa Aesar, product number 43344.
[0142] 5 The monovalent cupric oxide was from Alfa Aesar, product number 40188.
[0143] 6 Lanthanum trivalent oxide was obtained from Alfa Aesar, product number 41644.
[0144] 7 Trivalent yttrium oxide was obtained from Alfa Aesar, product number 44286.
[0145] The metal oxide group is mixed and heated to a temperature of 800°C to 1300°C to melt the oxides. Cool the glass to room temperature. The glass is then ground to provide a fine glass frit particl...
example 2
[0147] contains La 2 O 3 or Y 2 O 3 metallization paste for glass frit
[0148] Metallization pastes were prepared containing glass frits with various amounts of metal oxide La 2 O 3 or Y 2 O 3 . The nominal contents of the metallization pastes are shown in Table 2.
[0149] Table 2 Metallization paste
[0150]
[0151]
[0152] 1.0wt% ETHOCEL TM Ethyl cellulose (STD4, The Dow Chemical Company) organic binder dissolved in 6.69 wt% Texanol at 60 °C TM (Texanol TM alcohol ester, Eastman Chemical Company), and 89 wt % spherical silver particles (AG-4-8, Tonghe High-Tech Co., Ltd.) having an average particle diameter of 2.0 μm, Example 1 having an average particle diameter of 1.0 μm and 2.5wt% glass frit with 350°C transition temperature Tg, with 200±25m 2 / g BET specific surface area of 0.01 wt% fumed silica ( 200, Evonik Co., Ltd.), 0.4wt% dispersant ( 102, BYK) and 0.4wt% thixotropic agent ( ST, Hemings Co., Ltd.) was added to the binder solution...
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