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Heat radiation structure for plate body, and manufacturing method thereof

A technology of a heat dissipation structure and a manufacturing method, which is applied in the field of thermal management, can solve the problem of low thermal efficiency of the heat dissipation structure of a plate body, and achieve the effect of improving the efficiency

Inactive Publication Date: 2019-01-01
NAT CENT FOR ADVANCED PACKAGING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, an embodiment of the present invention provides a plate heat dissipation structure and a manufacturing method thereof to solve the problem that the existing heat dissipation structure of the plate body does not discharge heat efficiently according to a predetermined channel during use.

Method used

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  • Heat radiation structure for plate body, and manufacturing method thereof
  • Heat radiation structure for plate body, and manufacturing method thereof
  • Heat radiation structure for plate body, and manufacturing method thereof

Examples

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Embodiment 1

[0030] An embodiment of the present invention provides a board body heat dissipation structure, and the board body heat dissipation structure is attached to the surface of the board body or embedded in the inside of the board body. The board body heat dissipation structure can be used to dissipate heat for high-power devices such as power devices or laser devices arranged on the PCB, and of course it can also be used to dissipate heat for other boards.

[0031] Figure 2E Shows a longitudinal sectional view of a plate body heat dissipation structure according to an embodiment of the present invention, Figure 1A and Figure 1B for Figure 2E Two possible top views of the heat dissipation structure of the plate in the longitudinal sectional view obtained by cross-cutting along XX'. Such as Figure 1A , Figure 1B and Figure 2E As shown, the board heat dissipation structure includes a core board A and at least one cover board B.

[0032] A groove 10 is provided on at least...

Embodiment 2

[0039] image 3 A flow chart of a manufacturing method of a plate heat dissipation structure according to an embodiment of the present invention is shown. This method can be used to manufacture the plate heat dissipation structure described in the first embodiment. Such as image 3 As shown, the method includes the following steps:

[0040] S101: Provide a groove on at least one surface of the core board, and the groove forms at least one continuous channel on the surface of the core board. Such as Figure 2A Shown, where A is the core plate, 10 is the groove.

[0041] S102: Forming a first metal layer on the surface of the core board on which grooves are opened. The first metal layer covers the inner wall of the groove. Such as Figure 2B As shown, 20 is the first metal layer.

[0042] S103: Form a second metal layer on at least one surface of the cover plate. Such as Figure 2CAs shown, where B is the cover plate, and 40 is the second metal layer.

[0043] S104: B...

Embodiment 3

[0047] The embodiment of the present invention provides another plate heat dissipation structure, which is attached to the surface of the plate or embedded in the inside of the plate. The board heat dissipation structure can be used to dissipate heat for high power consumption devices such as power devices or laser devices arranged on the PCB, and of course it can also be used to dissipate heat for other boards.

[0048] Figure 4F Shows a longitudinal sectional view of a plate body heat dissipation structure according to an embodiment of the present invention, Figure 1A , Figure 1B for Figure 4F Two possible top views of the heat dissipation structure of the plate in the longitudinal sectional view obtained by cross-cutting along XX'. Such as Figure 1A , Figure 1B and Figure 4F As shown, the board heat dissipation structure includes a core board A, a first cover board B1 and a second cover board B2.

[0049] The core plate A is provided with a through hole 10 passi...

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Abstract

The invention discloses a heat radiation structure for a plate body, and a manufacturing method thereof. The heat radiation structure for a plate body includes a core plate and at least one cover plate, wherein at least one surface of the core plate is equipped with a groove, and the groove forms at least one continuous channel in the surface of the core plate; the at least one cover plate is covered on the channel surface of the core plate to form at least one passage; and the inner wall of the channel is covered with a ring of metal layer. For the heat radiation structure for a plate body, as a passage is formed between the core plate and the cover plate and the inner wall of the channel is covered with a ring of metal layer and the compactness of the metal layer is higher, when the gasor liquid acted as the heat carrier is filled in the passage, the gas or liquid is hard to permeate into the core plate to further diffuse, thus improving the efficiency of discharging the heat according to the preset passage.

Description

technical field [0001] The invention relates to the technical field of heat management, in particular to a plate heat dissipation structure and a manufacturing method thereof. Background technique [0002] PCB board (English full name: Printed Circuit Board, Chinese: printed circuit board or printed circuit board) is an important electronic component, a support for electronic components, and a carrier for electrical connections of electronic components. When high-power components such as power devices and laser devices are installed on the PCB, they tend to dissipate a large amount of heat, which is likely to cause local overheating of the PCB. For this reason, the prior art provides a way of dissipating heat from a part of a board such as a PCB board through a microchannel. [0003] In the prior art, for the heat dissipation structure of the plate body, continuous grooves are often opened on the surface of the core plate to form channels, and then the cover plate is presse...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0201H05K1/0272H05K3/00H05K2201/09063H05K2203/063
Inventor 陈钏侯峰泽
Owner NAT CENT FOR ADVANCED PACKAGING
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