Microelectronic intelligent pillow
A technology of microelectronics and headrests, which is applied in the direction of pillows, other medical devices, heating appliances for treatment, etc., can solve the problems of lack of headrests, affecting the quality of sleep, etc., to reduce the accumulation of sweat, increase the flow, and use convenient effect
Inactive Publication Date: 2019-01-04
安徽星宇生产力促进中心有限公司
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Problems solved by technology
[0004] The purpose of the present invention is to provide a kind of microelectronic intelligent headrest, to solve the problem that the microelectronic technology proposed in the above-mentioned background technology has many applications in daily life, the pillow is an indispensable appliance for everyone, and the comfort of the pillow Directly affects the quality of sleep, lacks the problem of corresponding headrest in the prior art
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[0014] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0015] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "end", "front end", "rear end", "both ends", "one end" , "the other end" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating o...
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The invention discloses a microelectronic intelligent pillow, including a pillow body, the left and right sides of the pillow body are preset with openings. An outer frame is arranged inside the pillow body, a power module is arranged on the top of the outer frame, and a cross beam is arranged inside the outer frame. The beam divides the interior of the outer frame into four filled areas. In addition, a support plate is installed in the middle position of the cross beam, a heat wire is arranged inside the filling area, a pressure sensor is provided in the middle position of the support plate,and a driving motor is arranged around the supporting plate, and a massage ball is arranged outside the head pillow main body corresponding to the driving motor. The microelectronic intelligent head pillow is provided with a driving motor and a massage ball inside the pillow for massaging the neck when the user sleeps and relieving pressure. In addition, three memory cotton pads are arranged inside the head pillow, and air holes are preset in the memory cotton pads, so that the memory cotton pads can be deformed according to the habit of the user for a long time, and the memory cotton pads aremore suitable for the body of the user.
Description
technical field [0001] The invention relates to the technical field of microelectronic equipment, in particular to a microelectronic intelligent headrest. Background technique [0002] Microelectronics technology is a new technology developed along with integrated circuits, especially VLSIs. The theoretical basis for its development is the modern physics established during the period from the end of the 19th century to the 1930s. Microelectronics technology includes a series of specialized technologies such as system circuit design, device physics, process technology, material preparation, automatic testing, packaging, and assembly. Microelectronics technology is the sum of various process technologies in microelectronics. Microelectronic technology has many applications in daily life, and pillow is everyone's requisite appliance, and the comfort of pillow directly affects the quality of sleep, and lacks corresponding headrest in the prior art. [0003] Therefore, how to d...
Claims
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IPC IPC(8): A61H15/02A61F7/00A61M37/00A47G9/10A61M21/02
CPCA47G9/1036A61F7/007A61F2007/0012A61H15/0078A61H15/02A61H2015/005A61H2201/0207A61H2201/105A61H2201/1207A61H2201/1611A61H2205/04A61M21/02A61M37/00A61M2021/0077A61M2037/0007
Inventor 吴胜松叶桂如吴胜琴
Owner 安徽星宇生产力促进中心有限公司