Pressure-sensitive conductive adhesive tape

Abstract

The invention relates to pressure-sensitive conductive adhesive tape. The pressure-sensitive conductive adhesive tape comprises an adhesive layer and a release material layer, and the release materiallayer comprises a flexible hollow layer and a stress luminescent layer, wherein the flexible hollow layer is filled with the stress luminescent layer; the stress luminescent layer is divided into anupper hollow layer and a lower hollow later through a glass membrane, the upper hollow layer and the lower hollow later are filled with a fluorescent agent and an exciting agent respectively, the fluorescent agent adopts fluorescent dye and phenyloxalate, and the exciting agent adopts hydrogen peroxide; under the oxidative action of the hydrogen peroxide, an intermediate product of 1,2-dioxyheterocyclic butanedione can be generated, the product is extremely unstable, is spontaneously decomposed and releases energy, and the energy is transmitted to fluorescent dye molecules, so that the productenters an excited state and lastly returns to a low-energy base state from the excited state, thereby giving out light; when the adhesive tape is pressed downward, the glass membrane is damaged afterbeing subjected to external acting force, the fluorescent agent and exciting agent on the breakage react, thereby giving out light; therefore, during pressing and adhesion, only a luminous point in the release material layer is observed, if no light is given out or the light is weaker somewhere, further pressing needs to be carried out.

Description

technical field [0001] The invention relates to an adhesive tape, in particular to a pressure-sensitive conductive adhesive tape. Background technique [0002] The pressure-sensitive tape is composed of a strip-shaped substrate and a pressure-sensitive adhesive coated on the strip-shaped substrate. The pressure-sensitive adhesive is the most important part of the pressure-sensitive tape, and its function is to make the pressure-sensitive tape have a pressure-sensitive adhesive. Attachment characteristics; due to the characteristics of easy to use, clean and good processing size, the pressure-sensitive tape is widely used in the attachment of printing plates and the processing of electronic industries. It overcomes the solvent volatilization and the required drying time during the operation of the structural adhesive, and can improve the working environment. [0003] When the pressure-sensitive tape is used, it achieves the bonding effect by applying pressure for a short tim...

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Problems solved by technology

[0003] When the pressure-sensitive tape is used, it achieves the bonding effect by applying pressure for a short time; but the part where no pressure is applied cannot play the bonding effect. This kind of pressure-sensitive tape is often used for pasting electronic devices, etc. The internal structure of the electronic device is fine, and it is impossible to place a large object that can completely cover the surface of the pressure-sensitive tape on it to increase the pressure on its surface; therefore, other small objects are often used to forcefully scratch the surface of the pressure-sensitive tape. Complete the bonding of the pressure-sensitive tape, but scratches will not leave marks on the surface of the pressure-sensitive tape, so some places on the pressure-sensitive tape will not be scratched, that is, there will be no sticky effect

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