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A liquid metal-based insulating and heat-conducting nanomaterial and its preparation and application

A liquid metal and nanomaterial technology, applied in the field of thermal conductive materials, can solve problems such as oil seepage and instability of liquid metal insulating thermal conductive adhesive materials, and achieve the effects of high thermal conductivity, expansion of functions and properties, and reduction of corrosion.

Active Publication Date: 2021-03-12
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, it should be pointed out that the liquid metal insulating heat-conducting adhesive material prepared by heating, stirring, and oxidation is very unstable, and oil seepage occurs after a period of storage; when it is applied to the surface of heat-dissipating objects, when the thickness of the applied layer becomes thinner, the liquid metal easy to precipitate

Method used

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  • A liquid metal-based insulating and heat-conducting nanomaterial and its preparation and application
  • A liquid metal-based insulating and heat-conducting nanomaterial and its preparation and application
  • A liquid metal-based insulating and heat-conducting nanomaterial and its preparation and application

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Experimental program
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Effect test

Embodiment 1

[0053] The preparation process is as figure 1 , specifically the following steps:

[0054] (1) First, take 0.8ml Span-85 and add it to 150ml absolute ethanol, heat to 60°C and electromagnetically stir for 5-10 minutes to prepare a modifying solution for treating liquid metal surfaces.

[0055] (2) Then take 24mLGa prepared in advance 75.5 In 24.5 Add it into the modified solution, ultrasonic power 100W, ultrasonic 20 minutes each time, ultrasonic three times in total, to obtain a stable dispersed suspension.

[0056] (3) According to the liquid metal and methyl silicone oil 3:1 (volume ratio), add methyl silicone oil (8mL silicone oil in this example) to the liquid metal suspension and heat to 60°C and continue stirring to form a uniformly mixed paste thing.

[0057] (4) When most of the absolute ethanol has evaporated, cool the paste to room temperature, put it in a vacuum drying oven, set the temperature at 22°C, and take it out after 12 hours of vacuum exhaust.

[0058...

Embodiment 2

[0061] The flow process of embodiment 2 material preparation is as figure 1 , specifically the following steps:

[0062] (1) First, take 0.8ml Span-85 and add it to 150ml absolute ethanol, heat to 60°C and electromagnetically stir for 5-10 minutes to prepare a modifying solution for treating liquid metal surfaces.

[0063] (2) Then take 24ml Ga prepared in advance 75.5 In 24.5 Added to the modified solution and continued to sonicate for 20 minutes, and sonicated three times to obtain a stable dispersed suspension.

[0064] (3) According to the volume ratio of liquid metal and methyl silicone oil of 4:1, add methyl silicone oil to the liquid metal suspension, heat to 60°C and continue stirring to form a uniformly mixed paste.

[0065] (4) When most of the absolute ethanol has volatilized, cool the paste to room temperature, put it in a vacuum drying oven and take it out after vacuum exhausting.

[0066] The microscopic morphology of the material see image 3 , it can be se...

Embodiment 3

[0069] The flow process of embodiment 3 material preparation is as figure 1 , specifically the following steps:

[0070] (1) First, take 0.8ml Span-85 and add it to 150ml absolute ethanol, heat to 60°C and electromagnetically stir for 5-10 minutes to prepare a modifying solution for treating liquid metal surfaces.

[0071] (2) Then take 24ml Ga prepared in advance 75.5 In 24.5 Added to the modified solution and continued to sonicate for 20 minutes, and sonicated three times to obtain a stable dispersed suspension.

[0072] (3) According to the relationship between liquid metal and methyl silicone oil volume ratio of 5:1, add methyl silicone oil to the liquid metal suspension, heat to 60°C and continue stirring to form a uniformly mixed paste.

[0073] (4) When most of the absolute ethanol has volatilized, cool the paste to room temperature, put it in a vacuum drying oven and take it out after vacuum exhausting.

[0074] The microscopic morphology of the material see Figu...

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Abstract

The present invention proposes a liquid metal-based insulating and heat-conducting nanomaterial, which is a silicon material dispersed with liquid metal nanoparticles. The volume fraction of liquid metal in the insulating and heat-conducting nano-material is 0.1-90%. The insulating and heat-conducting nano-material Volume resistivity ≥ 10 9 Ω·m. The invention also proposes the preparation and application of the insulating and heat-conducting nanometer material. Compared with the existing liquid metal insulating and heat-conducting adhesive, the liquid metal insulating and heat-conducting nano-material proposed by the present invention has further expanded functions and properties, greatly reducing the corrosion of liquid metal interface materials and different substrate materials, especially aluminum materials, and at the same time It also maintains the high thermal conductivity of the liquid metal interface material.

Description

technical field [0001] The invention belongs to the field of heat-conducting materials, and in particular relates to a heat-conducting material containing liquid metal and its preparation and application. Background technique [0002] With the high integration of electronic chips, electric vehicles and other equipment, the power density of the equipment is increasing. Excessively high power density in a very small space can easily lead to excessive local temperature of the equipment. High temperatures can cause equipment to slow down, devices to fail mid-work, burn people, and many other performance issues. Therefore, for this type of product, it has become one of the crucial challenges in the design to effectively remove the heat generated by high-density power in a space with compact structure and narrow operation. [0003] As we all know, there is a layer of air gap between the electronic components and the heat dissipation equipment. Due to the poor thermal conductivity...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K5/10
CPCC09K5/10
Inventor 饶伟樊攀刘静王康
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI