High-temperature-resistant wall plate and preparation method
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A high-temperature-resistant wallboard technology, which is applied to building components, buildings, building structures, etc., can solve the problems of wallboards being affected by moisture, forming water droplets or water vapor, and poor sound insulation effects of wallboards, so as to speed up dehumidification efficiency and heat insulation Good wear resistance and heat insulation
Inactive Publication Date: 2019-01-04
贵州西奥轻质节能板材有限公司
View PDF0 Cites 10 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0003] Because the wallboard is installed on the wall, it needs to have the function of high temperature resistance, and in the case of rainy weather or large temperature difference outside, the wall is easy to form water droplets or water vapor, which will cause the wallboard to be damp and affect the service life. , the wallboard is impacted, the traditional wallboard does not have the cushioning effect, and the sound insulation effect of the traditional wallboard is poor. Therefore, it is necessary to design a high temperature resistant type wallboard and its preparation method
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0029] see Figure 1-3 , The present invention provides a high temperature resistant wallboard, comprising substrate layer 1, moisture absorption layer 2, quicklime board 3, waterproof layer 4, moisture proof board 5, sound insulation layer 6, heat insulation layer 7, glass fiber 8, high temperature resistant layer 9 , ceramic fiber board 10, first cavity 11, heating and dehumidification mechanism 12, heat dissipation hole 19, through hole 20, sound insulation...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Login to view more
Abstract
The invention discloses a high-temperature-resistant wall plate and a preparation method. The high-temperature-resistant wall plate comprises a substrate layer, a moisture absorption layer, a quick lime plate, a waterproof layer, a damp-proof plate, a sound-insulation layer, a heat-insulation layer, glass fibers, a high-temperature-resistant layer, a ceramic fiber board, a first cavity, a heatingand dehumidifying mechanism, heat-dissipation holes, a through hole, a sound-insulation plate, a first sound absorbing plate, a second sound absorbing plate, a spring, a buffer cavity, a sound absorbing hole, sound absorbing cotton, a spring hole, a second cavity, a first metal plate, a second metal plate and a heat-conduction rod, wherein the moisture absorption layer is arranged at one end of the substrate layer and consists of the quick lime plate; the waterproof layer is arranged at one end of the moisture absorption layer and consists of the damp-proof plate; the sound-insulation layer isarranged; and because the outermost layer of the sound-insulation layer is a second sound absorbing plate, sound successively penetrates through the second sound absorbing plate, the buffer cavity and the first sound absorbing plate, noises are gradually reduced and absorbed, and meanwhile, under cooperation of the spring and the sound absorbing cotton, damping and buffering effects can be achieved effectively when the wall plate is impacted.
Description
technical field [0001] The invention relates to the technical field of building materials, in particular to a high-temperature-resistant wallboard and a preparation method thereof. Background technique [0002] Wall panel refers to a kind of building material, which is a building structure composed of walls and floors. The load-bearing wall of the wall panel structure can be made of bricks, blocks, prefabricated or cast-in-place concrete. It can be divided into different types according to the materials used and construction methods. Mixed structure, prefabricated large slab structure, and cast-in-place wall panel structure. Wall panels are an important part of buildings. It can be used in public buildings such as office buildings and schools. [0003] Because the wallboard is installed on the wall, it needs to have the function of high temperature resistance, and in the case of rainy weather or large temperature difference outside, the wall is easy to form water droplets o...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.