Optical assembly, optical projection module, sensing device and device

Abstract

The present application is applicable to the field of optical and electronic technology and provides an optical projection module for projecting a pattern beam having a preset pattern onto a measuredobject for sensing. The optical projection module comprises a VCSEL light source for providing a beam; And an optical component, comprising an entrance side and an exit side, wherein the entrance sideand the exit side are adjacent two sides; Wherein the VCSEL light source emits a light beam to the incident light side, the optical assembly deflects a propagation direction of a light beam from a VCSEL light source from a first direction to a second direction different from the first direction, and the light field of the light beam is rearranged to form a pattern light beam capable of projectinga preset pattern, and the pattern light beam propagating in the second direction is finally projected from the light outgoing side to reduce the thickness of the entire optical projection module in the second direction. The present application also provides a sensing device and apparatus including the optical projection module.

Description

technical field [0001] The present application belongs to the field of optical technology, and in particular relates to an optical component, an optical projection module, a sensing device and equipment. Background technique [0002] The existing three-dimensional (Three Dimensional, 3D) face recognition module is usually made relatively thick due to the internal need to ensure sufficient optical path, which does not conform to the current design trend of thinning electronic equipment. And if the internal optical path of the 3D face recognition module is compressed in order to meet the thin design, it will affect its recognition effect. Contents of the invention [0003] The technical problem to be solved in this application is to provide a new type of optical component, optical projection module, sensing device and equipment, which can meet the thinning design requirements while maintaining a sufficient optical path. [0004] The embodiment of the present application pro...

AI Technical Summary

Problems solved by technology

[0002] Existing three-dimensional (Three Dimensional, 3D) face recognition modules are usually made relatively thick due to the need to ensure sufficient optical path internally, which does not conform to the current design trend of thinning electronic equipment

And if the internal optical path of the 3D face recognition module is compressed in order to meet the thin design, it will affect its recognition effect

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