A kind of PCB internal thick copper structure, multi-layer printed circuit board and preparation method thereof
A printed circuit board and circuit technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., to achieve the effect of simple operation, simple and convenient lamination process, and low production requirements
Active Publication Date: 2021-02-12
UNIV OF ELECTRONICS SCI & TECH OF CHINA +1
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Problems solved by technology
[0005] In view of the above, in view of the defect of glue filling voids caused by uneven copper thickness on the board surface in the existing printed voltage board lamination process, the present invention provides a thick copper structure inside a PCB, a multilayer printed circuit board and its The preparation method, according to the preset thick copper line on the conductive carrier, first etches the bumps in the copper-free area to form a thick copper line, and then laminates the thick copper line to form a thick copper structure inside the PCB, thereby avoiding the phenomenon of glue filling voids , can improve the uniformity of plate thickness distribution, reduce the warpage of the plate, the production process is simple, the product reliability is strong, and the pass rate is high
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[0033] A method for preparing a printed circuit board with an internal thick copper structure, the specific operations are as follows:
[0034] Step 1: Attach a dry film on the surface of the tin plate 101, and obtain the tin plate 101 protected by the resist layer 102 after exposure and development, such as figure 1 shown;
[0035] Step 2: After etching the tin plate and removing the resist layer, a bump 103 with a thickness of 30-60 μm is obtained, as shown in figure 2 shown;
[0036] Step 3: Apply a liquid resist to the surface of the tin plate obtained in step 2, and obtain a protective layer 104 on the surface of the tin plate 101 after exposure and development, such as image 3 shown;
[0037] Step 4: Add electroplating to the surface of the tin plate obtained in step 3 to form a first thick copper circuit layer 105 with a thickness of 50-400 μm, and remove the protective layer 104, as Figure 4 As shown, the thick copper line layer in the figure shows the dense lin...
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The invention discloses a thick copper structure inside a PCB, a multilayer printed circuit board and a preparation method thereof, belonging to the technical field of printed circuit boards. The present invention selects a wire substrate different from the circuit material as the carrier, and according to the preset thick copper circuit, first etches bumps on the carrier without the circuit area, and then forms the preset circuit. The etched bumps can solve the problem of warping of laminates caused by uneven distribution of plate thickness and excessive difference in residual copper rate caused by traditional lamination methods; moreover, unlike the direct lamination of traditional lamination processes, the present invention Resin filling and pressing are carried out before the multilayer board is laminated to solve the problem of resin filling voids after lamination, and will not affect the transmission of line signals. Using the method to manufacture multilayer printed circuit boards has the advantages of low manufacturing requirements, simple operation and short time consumption, reduces costs while ensuring the reliability of printed circuit boards, and significantly improves production efficiency.
Description
technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a thick copper structure inside a PCB, a multilayer printed circuit board (PCB) with an inner thick copper structure and a preparation method thereof. Background technique [0002] With the advent of the new era of Industry 4.0, the requirements for the intelligence level of the global manufacturing industry are getting higher and higher, and the electronics industry is also developing towards high-end. As the main body of electronic products, the printed circuit board industry is also facing more and more severe challenges. challenge. Thick copper printed circuit boards are a special type of high-end printed circuit boards. As the application of thick copper printed circuit boards becomes more and more common, thick copper printed circuit boards show their advantages and can not be ignored. Defects. Thick copper printed circuit boards are formed by l...
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IPC IPC(8): H05K3/00H05K3/20H05K3/46
CPCH05K3/0094H05K3/202H05K3/4626
Inventor 陈苑明李高升何为王守绪喻涛李清华艾克华唐鑫
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA